Abstract: A voltage regulator including a comparing circuit, a first circuit, a transistor, a voltage reference circuit, and a latching circuit. The comparing circuit compares a first and second voltage references and generates an output based on the comparison. The first circuit amplifies the output of the comparing circuit. The transistor includes: a gate configured to receive a first output of the first circuit; a first terminal connected to a voltage supply terminal; and a second terminal. A regulated output voltage of the voltage regulator is based on a voltage at the second terminal. The voltage reference circuit generates the second voltage reference based on the voltage at the second terminal. The latching circuit, based on a second output of the first circuit: adjusts the second voltage reference; and switches between forcing the second output of the first circuit to be in a first state to be in a second state.

Abstract: The present disclosure describes apparatuses and techniques for device-based die authentication. In some aspects, an intensity of a particle beam is varied during semiconductor processing to provide a semiconductor die having devices of varied values. In other aspects, different areas of semiconductor dies are exposed during semiconductor processing to provide semiconductor dies with devices that vary in value from one die to the next. For each semiconductor die, a value generated based on the values of the die's respective devices can be associated with that die thereby enabling subsequent authentication of the semiconductor die.

Abstract: The present disclosure describes apparatuses and techniques for device-based die authentication. In some aspects, an intensity of a particle beam is varied during semiconductor processing to provide a semiconductor die having devices of varied values. In other aspects, different areas of semiconductor dies are exposed during semiconductor processing to provide semiconductor dies with devices that vary in value from one die to the next. For each semiconductor die, a value generated based on the values of the die's respective devices can be associated with that die thereby enabling subsequent authentication of the semiconductor die.

Abstract: A voltage regulator includes a comparing circuit configured to compare a first voltage reference to a second voltage reference and to generate an output. A first circuit applies gain to the output of the comparing circuit and buffers the output of the comparing circuit. A first transistor includes a gate in communication with an output of the first circuit, a first terminal in communication with a first voltage reference and a second terminal in communication with an output of the voltage regulator. A second circuit applies gain and buffers the output of the first circuit. A latching circuit receives an output of the second circuit. A voltage reference circuit generates the second voltage reference based on the output of the voltage regulator. A reference adjusting circuit receives an output of the latching circuit and selectively adjusts the second voltage reference.

Abstract: An apparatus includes micro-electromechanical (MEM) devices, a charge source, and a discharge mechanism. Each MEM device has different states based on a charged induced thereon. The charge source is to induce the charge thereon such that the MEM devices each enter one of the different states thereof. The discharge mechanism for the MEM devices is to discharge the induced thereon. The discharge mechanism includes one of a resistor for each MEM device and an ultraviolet (UV) light source. The resistor is to discharge the charge on its MEM device to ground. The UV light source is to emit photons onto the MEM devices, such that the photons discharge the charge on the MEM devices via photoelectric effect.

Abstract: A mirror device of one embodiment of the invention is for a projection system corresponding to one of a pixel and a sub-pixel of image data to be projected by the projection system. The mirror device comprises a plurality of tiltable mirrors. The mirrors are cooperatively tilted based on the one of the pixel and the sub-pixel of the image data, to reflect light projected incident thereto in accordance with the one of the pixel and the sub-pixel of the image data.

Abstract: One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Abstract: A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Abstract: One embodiment of a display system includes an array that defines multiple, movable reflective devices on a front surface of the array, and multiple immovable reflective regions each aligned along a projection axis with a corresponding space between ones of the reflective devices.

Abstract: A mirror device of one embodiment of the invention is for a projection system corresponding to one of a pixel and a sub-pixel of image data to be projected by the projection system. The mirror device comprises a plurality of tiltable mirrors. The mirrors are cooperatively tilted based on the one of the pixel and the sub-pixel of the image data, to reflect light projected incident thereto in accordance with the one of the pixel and the sub-pixel of the image data.

Abstract: An apparatus includes micro-electromechanical (MEM) devices, a charge source, and a discharge mechanism. Each MEM device has different states based on a charged induced thereon. The charge source is to induce the charge thereon such that the MEM devices each enter one of the different states thereof. The discharge mechanism for the MEM devices is to discharge the induced thereon. The discharge mechanism includes one of a resistor for each MEM device and an ultraviolet (UV) light source. The resistor is to discharge the charge on its MEM device to ground. The UV light source is to emit photons onto the MEM devices, such that the photons discharge the charge on the MEM devices via photoelectric effect.

Abstract: A micro-mirror device includes a substrate having a surface, and a plate spaced from and oriented substantially parallel to the surface of the substrate such that the plate and the surface of the substrate define a cavity therebetween. A dielectrophoretic liquid capable of movement when an electrical signal is applied to the micro-mirror device is disposed in the cavity, and a reflective element is interposed between the surface of the substrate and the plate such that the reflective element is adapted to move between a first position and at least one second position.

Abstract: An apparatus of one embodiment of the invention is disclosed that includes a number of micro-electromechanical (MEM) devices, a charge source, and at least one discharge path. Each MEM device has a plurality of different states based on a charge induced thereon. The charge source is to induce the charge thereon such that the MEM devices each enter one of the states. The at least one discharge path is for the plurality of MEM devices, and along which the charge induced thereon is dischargeable.

Abstract: A micro-mirror device includes a substrate, at least one electrode formed on the substrate, and a reflective element spaced from the substrate and extending beyond the at least one electrode. The reflective element is adapted to move between a first position and at least one second position, and, when the reflective element is in the at least one second position, a minimum distance between the reflective element and the at least one electrode is greater than a minimum distance between the reflective element and the substrate.

Abstract: A micro-mirror device includes a substrate, at least one electrode formed on the substrate, and a reflective element spaced from the substrate and extending beyond the at least one electrode. The reflective element is adapted to move between a first position and at least one second position, and, when the reflective element is in the at least one second position, a minimum distance between the reflective element and the at least one electrode is greater than a minimum distance between the reflective element and the substrate.

Abstract: A micro-mirror device includes a substrate having a surface, and a plate spaced from and oriented substantially parallel to the surface of the substrate such that the plate and the surface of the substrate define a cavity therebetween. A dielectrophoretic liquid capable of movement when an electrical signal is applied to the micro-mirror device is disposed in the cavity, and a reflective element is interposed between the surface of the substrate and the plate such that the reflective element is adapted to move between a first position and at least one second position.

Abstract: This present invention is embodied in a system and a method for protecting an electrically-inactive component of a microsystem from an ESD event. The invention includes embodiments that protect the microsystem from ESD events that directly strike an electrically-inactive component and that are external to the electrically-inactive component. These embodiments include an ESD dissipation device having a connected chain of electrically-inactive components that are electrically floating as well as embodiments whereby the electrically-inactive components are held at the same potential as an electrical component. Furthermore, these embodiments include a sacrificial ESD breakdown device that provides a preferential ESD breakdown site away from the protected component and embodiments that provide a capacitively coupled thin-film layers that provide shielding to an electrically-inactive component.

Abstract: A tape automated bonding (TAB) frame and a process for testing the same. The frame is designed to receive a die, an integrated chip or other similar components having output leads. The frame generally comprises a relatively thin film of dielectric material, a pattern of substantially adjacent inner lead bonds, a pattern of substantially adjacent outer lead bonds for providing input/output ports to the die, and a pattern of substantilly adjacent probe points for providing test points to the frame and the die thereon. A generally flat and rigid plate is mounted on a prober for supporting both a cut-out portion of the frame and the die thereon. The testing process includes the steps of excising the die from the frame in the form of a coupon, such that the coupon contains the pattern of scrap probe points on the TAB frame and the die; placing the excised coupon onto the prober; aligning the coupon; and testing the coupon and the die.

Abstract: Method and apparatus for creating an electrical connection between a tape-assisted bonding (TAB) segment having a plurality of conductive leads formed thereon and a printed circuit board also having a plurality of conductive leads formed thereon. A sheet of polymeric material having conductive elements mounted thereon so that each element protrudes from both sides of the sheet is disposed between a plurality of TAB segment leads and a corresponding plurality of generally opposing printed circuit board leads. A clamp secures the TAB segment to the printed circuit board thereby sandwiching the conductive elements between the TAB segment leads and the printed circuit board leads thus creating electrical connections between the opposing leads.

Abstract: A tape automated bonding (TAB) test coupon excised from a TAB frame and a process for testing the coupon and the die mounted thereon. The coupon includes a relatively thin film of dielectric material and a pattern of substantially adjacent inner lead pads on the dielectric film. The inner lead pads are disposed in close proximity to the die. A pattern of substantially adjacent test probe pads generally surround the pattern of inner lead pads for providing test points for the frame and the die thereon. A pattern of substantially adjacent outer lead pads generally surround the pattern of test probe pads for providing input/output ports to the die. Electrical conductors interconnect the inner lead pads, the outer lead pads and the test probe pads in a predetermined conductive pattern. The inventive test process includes the steps of excising the die from the frame in the form of a coupon. The coupon contains the die, the inner lead pads and the pattern of test probe points.