Abstract: A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer having top and bottom surfaces, the system having upper and lower platen assemblies with a flow section configured to receive and discharge a temperature-controlled, circulated liquid heat transfer medium to maintain the temperatures of the top and bottom surfaces of the uncut semiconductor wafer within desired limits during wafer burn-in and testing and a programmable CPU and service controller configurable to selectively energize, monitor, test, display and store a plurality of performance parameters for the electronic circuitry of each of the plurality of die of the uncut semiconductor wafer simultaneously throughout a desired burn-in and test period.

Abstract: A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer; for establishing electrical connectivity in one-to-one correspondence between each die and a specific current amplifier, for monitoring, displaying, evaluating and recording test parameters in relation to preset parametric limits during a requisite test period; and for shutting down any individual die that exceeds the preset parametric limits. Methods of use and subsystems for raising and lowering a semiconductor wafer in relation to a pin chuck and for controlling wafer temperature by circulating a liquid heat exchange medium through platen assemblies disposed above and below the wafer are also disclosed.

Abstract: A device and system for securing adjacent segments of duct work formed from fibrous glass duct board insulation and the like is disclosed. The device comprises a corner member having two legs disposed at approximately right angles, each of said legs having oppositely facing and substantially parallel adjacent channels disposed therein to accommodate portions of opposed edges of adjacent segments of duct work. The system includes a plurality of corner members each having two legs disposed at approximately right angles, said legs having substantially parallel and oppositely facing adjacent channels disposed therein to accommodate at least a portion of the opposed edges of adjacent segments of duct work.

Abstract: A portable intravenous fluid warming system wherein the temperature monitoring and control is accomplished utilizing four monolithic IC thermosensors. The sensors operate in a serial multi-stage fashion with the first sensor functioning so as to provide a ramp or build up to the next stage thus smoothly and gently increasing the temperature of the fluid and reducing the dynamic range required for the final heater stage, thus ensuring a more accurate and consistent output temperature. Power FET's provide heater drive current from an unregulated DC input source. The sensor is coupled to a microprocessor that is factory preprogrammed with predetermined set points. The microprocessor will continuously determine the temperature so as to allow determination of when the desired temperature is reached and will adjust power to the FET as necessary to hold the temperature at the correct point without exceeding the temperature. Interfacing is provided to an optional external digital readout unit for monitoring.

Abstract: A multiple converter system is provided for a remote user in a cable communications system. The converters at the user location are linked together via a splitter. One converter operates as a master converter transmitting a master control signal to the other converters, designated as slave converters. The slave converters are actuated only upon reception of the master control signal. The master control signal is interrupted by the master converter only when it transmits data upstream to the central office or when one of the slave converters is required to transmit data. A slave converter notifies the master converter of the need to transmit data by a slave signal. A transmitter unit is automatically activated for transmitting data upstream upon the absence of the master signal on the bus.