Abstract: An adapter for a communication transceiver is provided. The adapter includes a main body having a first end and opposed second end. The first end of the main body has an OSFP (octal small form factor pluggable) edge connector arranged for electrical and physical connection to an OSFP host connector in an OSFP host port. The main body has a QSFP (quad small form factor pluggable) host connector arranged to receive a QSFP edge connector of a QSFP transceiver through the second end of the main body so that the adapter adapts the QSFP transceiver to an OSFP host. A method of using a communication adapter is also provided.

Abstract: Apparatus with orthogonal connectors. The apparatus includes a circuit board and the circuit board includes a set of processing devices. A first connector is coupled to the circuit board and the set of processing devices.

Abstract: A power supply includes a power supply unit. The power supply unit includes a first housing configured to interface with one or more of housings of one or more fan modules. The power supply unit also includes a power generation unit disposed within the housing. The power generation unit may be configured to generate power for an electrical device. The power supply further includes a first connector configured to provide power to the one or more fan modules. The power may be used to operate one or more fan units of the one or more fan modules. The power supply also includes a fan module. The fan module includes a second housing configured to interface with the first housing. The fan module also includes a fan unit disposed within the second housing. The fan unit may be configured to generate an airflow through the first housing. The fan module further includes a first attachment member configured to interface with the first connector.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: A light emitting device includes a light emitting diode chip (“LED”) that emits light having a dominant wavelength in the blue color range and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. The recipient luminophoric medium includes a green phosphor, a yellow phosphor, a first red phosphor having a first dominant wavelength and a second red phosphor having a second dominant wavelength that is different from the first dominant wavelength.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: A system may include a fan module and a louver. The fan module includes a first housing, adapted to include a fan in a first orientation. The fan is adapted to cause air to flow into the rear side of the first housing and out of the front side of the first housing. The fan module also includes a key receptacle that is adapted to mate with a first key. The louver includes a second housing that includes a set of slats adapted as a one way valve. The second housing also includes the first key which is adapted to only mate with the key receptacle. The second housing also includes the second key which is adapted to not mate with the key receptacle.

Abstract: A system may include a fan module and a louver. The fan module includes a first housing, adapted to include a fan in a first orientation. The fan is adapted to cause air to flow into the rear side of the first housing and out of the front side of the first housing. The fan module also includes a key receptacle that is adapted to mate with a first key. The louver includes a second housing that includes a set of slats adapted as a one way valve. The second housing also includes the first key which is adapted to only mate with the key receptacle. The second housing also includes the second key which is adapted to not mate with the key receptacle.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Abstract: A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.

Abstract: A fastener installation tool including a cylinder assembly, a handle/sleeve assembly, and a tool head. The handle/sleeve assembly includes a handle having a bore and a sleeve positioned within the bore. An inner wall of the sleeve includes a first portion with a first inner diameter and a second portion with a second inner diameter. The sleeve includes an outer wall having a first portion with a first outer diameter and a second portion with a second outer diameter, the first outer diameter of the first portion of the outer wall of the sleeve being greater than the second outer diameter of the second portion of the outer wall of the sleeve. A space is formed between the second portion of the outer wall of the sleeve and the second portion of the inner wall of the handle, which enables the sleeve to flex during operation of the tool.

Abstract: A compact connector is provided. The compact connector includes a connector body having a first group of one or more pins on a first face of a contact tip and a second group of one or more pins on an opposed second face of the contact tip. The first group of one or more pins engages with a first busbar, and the second group of one or more pins engages with a second busbar, wherein when the connector engages with the busbars the contact tip is disposed between the first and second busbars. A method of using a connector is also provided.

Abstract: An intelligent network patch field management system is provided that includes electronic hardware, firmware, mechanical assemblies, cables, and software that provide visible and audible cues for connecting and disconnecting patch cords in an interconnect or cross-connect patching environment. Systems of the present invention also monitor patch cord connections in a network.

Abstract: Embodiment of the present invention generally relate to the field of thermal capacity management within data centers, and more specifically, to methods and systems which provide feedback based on thermal information associated with parts of a data center. In an embodiment, the present invention is a method comprising the steps of using temperature measurements and power meter readings to provide real-time capacity usage information in a given data center and to use that information to perform moves/adds/changes with a particular level of confidence.