Patents by Inventor Robert Yarosh

Robert Yarosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having x-shaped die support member and method for making the same
    Patent number: 5424576
    Abstract: A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives.
    Type: Grant
    Filed: October 12, 1993
    Date of Patent: June 13, 1995
    Assignee: Motorola, Inc.
    Inventors: Frank Djennas, Isaac T. Poku, Robert Yarosh
  • Semiconductor device having universal low-stress die support and method for making the same
    Patent number: 5327008
    Abstract: A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives.
    Type: Grant
    Filed: March 22, 1993
    Date of Patent: July 5, 1994
    Assignee: Motorola Inc.
    Inventors: Frank Djennas, Isaac T. Poku, Robert Yarosh