Patents by Inventor ROBERT ZRILE

ROBERT ZRILE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
    Publication number: 20180218993
    Abstract: A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt including connection layer is deposited directly on the metal bond pad area. The cobalt including connection layer is patterned to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed on the cobalt bond pad surface.
    Type: Application
    Filed: March 27, 2018
    Publication date: August 2, 2018
    Inventors: HELMUT RINCK, GERNOT BAUER, ROBERT ZRILE, KAI-ALEXANDER SCHACHTSCHNEIDER, MICHAEL OTTE, HARALD WIESNER
  • Metal bond pad with cobalt interconnect layer and solder thereon
    Patent number: 9960135
    Abstract: A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt including connection layer is deposited directly on the metal bond pad area. The cobalt including connection layer is patterned to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed on the cobalt bond pad surface.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: May 1, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Helmut Rinck, Gernot Bauer, Robert Zrile, Kai-Alexander Schachtschneider, Michael Otte, Harald Wiesner
  • METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
    Publication number: 20160284656
    Abstract: A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt including connection layer is deposited directly on the metal bond pad area. The cobalt including connection layer is patterned to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed on the cobalt bond pad surface.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 29, 2016
    Inventors: HELMUT RINCK, GERNOT BAUER, ROBERT ZRILE, KAI-ALEXANDER SCHACHTSCHNEIDER, MICHAEL OTTE, HARALD WIESNER