Abstract: Apparatus for providing EMI/RFI shielding to cables connected between electrical circuitry contained within an enclosure and the exterior environment. A fixed supporting flange is secured to the enclosure adjacent to a gap in the enclosure. An adjustable compression flange is secured to the enclosure adjacent to the gap. Cables extending from inside of the enclosure to the exterior environment pass through the gap. A compliant, resilient gasket is positioned over the gap, between the supporting flange and the compression flange. The compression flange bearing against the cables compresses the cables into the gasket.

Abstract: The assembly comprises a U-shaped frame to which the card may be secured. The frame is defined by spaced parallel side elements and a connecting end element. Intermediate the ends of the frame a tie bar bridges flatly across the top of the frame and is adapted to hold down the card and tie the side elements together. The bar has downward legs at its opposite ends secured to the frame.

Abstract: A module for cooling equipment mounted in a frame. The module includes a plenum positioned between an upper portion and a lower portion of electronic equipment and a panel positioned across the plenum to occlude it. The panel is of multiplanar arcuate construction including a first, a second and a third panel portion each provided with an aperture in which is mounted to a fan. A pair of vanes between adjacent fans are provided. The vanes align themselves with the air flow from adjacent fans when both adjacent fans are operational and position themselves across the aperture of an adjacent fan when failed.

Abstract: A leadless ceramic chip carrier for surface mounting on an epoxy printed circuit board is shown featuring an arrangement for relieving the thermally induced stress by progressively lengthening the attaching solder pillars as the distance from the center line of the ceramic chip increases to avoid exceeding the elastic limits of the solder.