Patents by Inventor Roden R. Topacio, III

Roden R. Topacio, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package strip with stiffener
    Patent number: 8847383
    Abstract: An integrated circuit package strip employs a stiffener layer that houses a passive electronic component to maintain mechanical properties when a thinner substrate is used. The use of either a retention wall or a stiffener allows for the manufacture of these integrated circuit package using strip, matrix, or array technology where a larger board with a plurality of integrated circuit packages is produced industrially and then cut to individual units.
    Type: Grant
    Filed: February 1, 2012
    Date of Patent: September 30, 2014
    Assignee: ATI Technologies ULC
    Inventors: Neil R. McLellan, Vincent K. Chan, Roden R. Topacio, III