Patents by Inventor Rodney C. Langley
Rodney C. Langley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6838390Abstract: A method utilizing a plasma etching machine which comprises a process chamber defining an interior region and including a bottom wall having an aperture and a block disposed in the aperture and including a longitudinally extending bore. A shaft extends through the bore and includes a spider push rod extending longitudinally therethrough. An internally cooled chuck is coupled to the shaft and disposed in the interior region and cooperates with the shaft to define a chamber. A spider is disposed in the chamber and is coupled to the push rod. A lift mechanism is coupled to the shaft and the push rod so that the spider pushes up on a wafer in response to actuation of the lift mechanism. A wafer clamping mechanism is coupled to the push rod if a mechanical clamp is used. In the case of electrostatic clamp the bias applied to the chuck is coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. A RF source is needed for ionization of the gas.Type: GrantFiled: February 22, 2000Date of Patent: January 4, 2005Assignee: Micron Technology, Inc.Inventors: Rodney C. Langley, David R. Johnson, Willard L. Hofer
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Publication number: 20020142593Abstract: A plasma etching machine comprises a process chamber defining an interior region and including a bottom wall having an aperture and a block disposed in the aperture and including a longitudinally extending bore. A shaft extends through the bore and includes a spider push rod extending longitudinally therethrough. An internally cooled chuck is coupled to the shaft and disposed in the interior region and cooperates with the shaft to define a chamber. A spider is disposed in the chamber and is coupled to the push rod. A lift mechanism is coupled to the shaft and the push rod so that the spider pushes up on a wafer in response to actuation of the lift mechanism. A wafer clamping mechanism is coupled to the push rod if a mechanical clamp is used. In the case of electrostatic clamp the bias applied to the chuck is coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. A RF source is needed for ionization of the gas.Type: ApplicationFiled: February 22, 2000Publication date: October 3, 2002Inventors: Rodney C. Langley, David R. Johnson, William L. Hofer
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Patent number: 6424733Abstract: A cluster tool includes an inspection station for inspecting semiconductor wafers. The cluster tool includes a plurality of process/reaction chambers and an inspection chamber coupled thereto. A transport module provides a transport mechanism for transporting the semiconductor wafer from the process/reactio chamber to the inspection chamber. The inspection chamber includes a light source, a light receiver, and an image processor. The light source illuminates the semiconductor wafer with a beam of light and the receiver receives a reflected image. The processor processes the received image to detect a defect and provides a warning signal to an operator when a defect is detected.Type: GrantFiled: July 20, 1998Date of Patent: July 23, 2002Assignee: Micron Technology, Inc.Inventor: Rodney C. Langley
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Patent number: 6380100Abstract: In one aspect, the invention encompasses an apparatus for semiconductor processing comprising: a) at least one support member comprising an upper surface for supporting a semiconductor wafer; b) a component through which the support member extends, the component comprising a front surface and a back surface, at least one of the support member and the component being movable relative to the other of the support member and the component such that the support member can support a wafer in an elevated position above the front surface and can be withdrawn into the component to lower the wafer relative to the front surface of the component; and c) a block joined to the support member below the component back surface, the block engaging the component back surface when the support member upper surface extends above the component to a predetermined distance, the block preventing the support member upper surface from extending beyond the front surface by more than the predetermined distance.Type: GrantFiled: May 15, 2001Date of Patent: April 30, 2002Assignee: Micron Technology, Inc.Inventors: J. Brett Rolfson, Rodney C. Langley
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Patent number: 6293789Abstract: An apparatus for semiconductor processing includes: a) at least one support member comprising an upper surface for supporting a semiconductor wafer; b) a component through which the support member extends, the component comprising a front surface and a back surface, at least one of the support member and the component being movable relative to the other of the support member and the component such that the support member can support a wafer in an elevated position above the front surface and can be withdrawn into the component to lower the wafer relative to the front surface of the component; and c) a block joined to the support member below the component back surface, the block engaging the component back surface when the support member upper surface extends above the component to a predetermined distance, the block preventing the support member upper surface from extending beyond the front surface by more than the predetermined distance.Type: GrantFiled: April 14, 2000Date of Patent: September 25, 2001Assignee: Micron Technology, Inc.Inventors: J. Brett Rolfson, Rodney C. Langley
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Publication number: 20010019899Abstract: In one aspect, the invention encompasses an apparatus for semiconductor processing comprising: a) at least one support member comprising an upper surface for supporting a semiconductor wafer; b) a component through which the support member extends, the component comprising a front surface and a back surface, at least one of the support member and the component being movable relative to the other of the support member and the component such that the support member can support a wafer in an elevated position above the front surface and can be withdrawn into the component to lower the wafer relative to the front surface of the component; and c) a block joined to the support member below the component back surface, the block engaging the component back surface when the support member upper surface extends above the component to a predetermined distance, the block preventing the support member upper surface from extending beyond the front surface by more than the predetermined distance.Type: ApplicationFiled: May 15, 2001Publication date: September 6, 2001Inventors: J. Brett Rolfson, Rodney C. Langley
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Publication number: 20010012392Abstract: A cluster tool includes an inspection station for inspecting semiconductor wafers. The cluster tool includes a plurality of process/reaction chambers and an inspection chamber coupled thereto. A transport module provides a transport mechanism for transporting the semiconductor wafer from the process/reactio chamber to the inspection chamber. The inspection chamber includes a light source, a light receiver, and an image processor. The light source illuminates the semiconductor wafer with a beam of light and the receiver receives a reflected image. The processor processes the received image to detect a defect and provides a warning signal to an operator when a defect is detected.Type: ApplicationFiled: July 20, 1998Publication date: August 9, 2001Inventor: RODNEY C. LANGLEY
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Patent number: 6248671Abstract: In one aspect, the invention encompasses an apparatus for semiconductor processing comprising: a) at least one support member comprising an upper surface for supporting a semiconductor wafer; b) a component through which the support member extends, the component comprising a front surface and a back surface, at least one of the support member and the component being movable relative to the other of the support member and the component such that the support member can support a wafer in an elevated position above the front surface and can be withdrawn into the component to lower the wafer relative to the front surface of the component; and c) a block joined to the support member below the component back surface, the block engaging the component back surface when the support member upper surface extends above the component to a predetermined distance, the block preventing the support member upper surface from extending beyond the front surface by more than the predetermined distance.Type: GrantFiled: August 19, 1998Date of Patent: June 19, 2001Assignee: Micron Technology, Inc.Inventors: J. Brett Rolfson, Rodney C. Langley
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Patent number: 6080272Abstract: A plasma etching machine comprises a process chamber defining an interior region and including a bottom wall having an aperture and a block disposed in the aperture and including a longitudinally extending bore. A shaft extends through the bore and includes a spider push rod extending longitudinally therethrough. An internally cooled chuck is coupled to the shaft and disposed in the interior region and cooperates with the shaft to define a chamber. A spider is disposed in the chamber and is coupled to the push rod. A lift mechanism is coupled to the shaft and the push rod so that the spider pushes up on a wafer in response to actuation of the lift mechanism. A wafer clamping mechanism is coupled to the push rod if a mechanical clamp is used. In the case of electrostatic clamp the bias applied to the chuck is coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. A RF source is needed for ionization of the gas.Type: GrantFiled: May 8, 1998Date of Patent: June 27, 2000Assignee: Micron Technology, Inc.Inventors: Rodney C. Langley, David R. Johnson, Willard L. Hofer
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Patent number: 5789754Abstract: In one aspect, a method of detecting leaks of external atmospheric gases into a plasma reactor comprises monitoring an emission spectra of a plasma within the reactor for the presence of an external atmospheric constituent. In another aspect, a method of detecting an external atmospheric leak in a plasma enhanced reactor comprising detecting photon emission of excited nitrogen present within the reactor.Type: GrantFiled: August 19, 1996Date of Patent: August 4, 1998Assignee: Micron Technology, Inc.Inventors: David A. Cathey, Rodney C. Langley
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Patent number: 5686762Abstract: A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of the bond pads. The opening(s) may include recesses extending partially into the bonding surface or channels that extend entirely through the bond pads. Various shapes and configurations of the openings may be used, such as a pattern of channels radiating from the center of the bonding surface, a series of spaced apart rectangular channels arranged parallel to one another, an array of L shaped channels arranged around the center of the bonding surface, or an array of holes.Type: GrantFiled: December 21, 1995Date of Patent: November 11, 1997Assignee: Micron Technology, Inc.Inventor: Rodney C. Langley
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Patent number: 5376235Abstract: A semiconductor wafer is washed in a dilute phosphoric acid solution after the metal features have been patterned and etched, thereby removing substantially all of the residual oxide, chlorine, and/or fluorine contamination which remains on the features. This will substantially eliminate corrosion of the features. The phosphoric acid wash also substantially prevents voids from forming during a subsequent alloy step. The features can include bond pads, vias, contacts, interconnects, etc.Type: GrantFiled: July 15, 1993Date of Patent: December 27, 1994Assignee: Micron Semiconductor, Inc.Inventor: Rodney C. Langley
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Patent number: 5221414Abstract: Extraneous and undesirable particulate matter is suppressed in a reaction chamber for treating semiconductor materials by depositing a thin layer of polymeric or equivalent insulating material over the entire interior surfaces of the reaction chamber prior to any treatment therein of semiconductor wafers or the like. This process is repeated as necessary after the initial treatment of the wafers has begun, and this treatment will typically include the layer deposition and layer etching on the surfaces of the semiconductor wafers. The periodic intervals between subsequent polymer layer deposition within the reaction chamber is selected in proportion to measured etch or deposition rates therein to thereby optimize the stability and uniformity of these etch and deposition rates, while simultaneously maintaining a maximum degree of cleanliness within the reaction chamber and minimizing down time therefor.Type: GrantFiled: July 16, 1991Date of Patent: June 22, 1993Assignee: Micron Technology, Inc.Inventors: Rodney C. Langley, James L. Dale
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Patent number: RE40819Abstract: A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of the bond pads. The opening(s) may include recesses extending partially into the bonding surface or channels that extend entirely through the bond pads. Various shapes and configurations of the openings may be used, such as a pattern of channels radiating from the center of the bonding surface, a series of spaced apart rectangular channels arranged parallel to one another, an array of L shaped channels arranged around the center of the bonding surface, or an array of holes.Type: GrantFiled: November 11, 1999Date of Patent: July 7, 2009Assignee: Micron Technology, Inc.Inventor: Rodney C. Langley