Patents by Inventor Rodney D. Cameron

Rodney D. Cameron has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Switchable transmit and receive phased array antenna with high power and compact size
    Patent number: 10756445
    Abstract: A switchable transmit and receive phased array antenna (“STRPAA”) is disclosed. The STRPAA includes a housing, a plurality of radiating elements, and a plurality of transmit and receive (“T/R”) modules. The STRPAA may also include either a first multilayer printed wiring board (“MLPWB”) configured to produce a first elliptical polarization or a second MLPWB configured to produce a second elliptical polarization within the housing.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: August 25, 2020
    Assignee: THE BOEING COMPANY
    Inventors: Ming Chen, Jimmy S. Takeuchi, Rodney D. Cameron, Michael S. Foster, Mark R. Davis
  • Switchable transmit and receive phased array antenna
    Patent number: 10297923
    Abstract: Disclosed is a switchable transmit and receive phased array antenna (“STRPAA”). As an example, the STRPAA may include a housing, a multilayer printed wiring board (“MLPWB”) within the housing having a top surface and a bottom surface, a plurality of radiating elements located on the top surface of the MLPWB, and a plurality of transmit and receive (“T/R”) modules attached to the bottom surface of the MLPWB. The STRPAA may also include a plurality of vias, wherein each via, of the plurality of vias, passes through the MLPWB and is configured as a signal path between a T/R module, of the plurality of T/R modules, on the bottom surface of the MLPWB and a radiating element, of the plurality of radiating elements, located on the top surface of the MLPWB opposite the T/R module.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 21, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Ming Chen, Jimmy Susumu Takeuchi, Rodney D. Cameron, Isaac R. Bekker, Peter T. Heisen, Dan R. Miller, Randal L. Ternes
  • SWITCHABLE TRANSMIT AND RECEIVE PHASED ARRAY ANTENNA WITH HIGH POWER AND COMPACT SIZE
    Publication number: 20170237181
    Abstract: A switchable transmit and receive phased array antenna (“STRPAA”) is disclosed. The STRPAA includes a housing, a plurality of radiating elements, and a plurality of transmit and receive (“T/R”) modules. The STRPAA may also include either a first multilayer printed wiring board (“MLPWB”) configured to produce a first elliptical polarization or a second MLPWB configured to produce a second elliptical polarization within the housing.
    Type: Application
    Filed: January 31, 2017
    Publication date: August 17, 2017
    Inventors: MING CHEN, JIMMY S. TAKEUCHI, RODNEY D. CAMERON, MICHAEL S. FOSTER, MARK R. DAVIS
  • Radio frequency grounding sheet for a phased array antenna
    Patent number: 9472843
    Abstract: A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: October 18, 2016
    Assignee: The Boeing Company
    Inventors: Jimmy S. Takeuchi, Rodney D. Cameron, Peter T. Heisen
  • SWITCHABLE TRANSMIT AND RECEIVE PHASED ARRAY ANTENNA
    Publication number: 20160172755
    Abstract: Disclosed is a switchable transmit and receive phased array antenna (“STRPAA”). As an example, the STRPAA may include a housing, a multilayer printed wiring board (“MLPWB”) within the housing having a top surface and a bottom surface, a plurality of radiating elements located on the top surface of the MLPWB, and a plurality of transmit and receive (“T/R”) modules attached to the bottom surface of the MLPWB. The STRPAA may also include a plurality of vias, wherein each via, of the plurality of vias, passes through the MLPWB and is configured as a signal path between a T/R module, of the plurality of T/R modules, on the bottom surface of the MLPWB and a radiating element, of the plurality of radiating elements, located on the top surface of the MLPWB opposite the T/R module.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Ming Chen, Jimmy Susumu Takeuchi, Rodney D. Cameron, Isaac R. Bekker, Peter T. Heisen, Dan R. Miller, Randal L. Ternes