Abstract: Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.

Abstract: Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.

Abstract: A heat sink assembly comprises a plurality of components and a plurality of mounting tabs. A component attachment surface of each mounting tab is attached to a component and heat sink attachment surfaces of the plurality of mounting tabs are at least substantially coplanar. A heat sink element is attached to at least some of the plurality of mounting tabs at the heat sink attachment surface thereof. A method of assembling a heat sink assembly comprises attaching a plurality of mounting tabs to at least one substantially planar assembly surface of an assembly fixture. Each mounting tab is attached to a heat-generating component to form a mechanical and thermal coupling therebetween. The assembly fixture is removed from the plurality of mounting tabs, and a heat sink element is attached to mounting tabs of the plurality.

Abstract: A heat sink assembly comprises a plurality of components and a plurality of mounting tabs. A component attachment surface of each mounting tab is attached to a component and heat sink attachment surfaces of the plurality of mounting tabs are at least substantially coplanar. A heat sink element is attached to at least some of the plurality of mounting tabs at the heat sink attachment surface thereof. A method of assembling a heat sink assembly comprises attaching a plurality of mounting tabs to at least one substantially planar assembly surface of an assembly fixture. Each mounting tab is attached to a heat-generating component to form a mechanical and thermal coupling therebetween. The assembly fixture is removed from the plurality of mounting tabs, and a heat sink element is attached to mounting tabs of the plurality.

Abstract: An apparatus comprises one or more pairs of mutually coaxial and opposing linear measuring devices including movable, biased fingers for simultaneously determining the thickness and warpage of a substrate such as a circuit board passing between the movable fingers. Each measuring device is calibrated to a zero point by bringing the ends of the movable fingers together and recording the distance or position thereof. Data for computation of substrate thickness and warpage measurements is obtained by recording displacement distances or positions of the movable fingers in contact with opposing surfaces of the substrate with respect to the zero point, the thickness and warpage then being calculated. The apparatus may be integrated with an assembly line, including incorporation with an existing piece of equipment, so that substrates exhibiting out-of-specification thickness or excessive warpage may be reworked, discarded or downgraded during the manufacturing process.

Abstract: An apparatus comprises one or more pairs of mutually coaxial and opposing linear measuring devices including movable, biased fingers for simultaneously determining the thickness and warpage of a substrate such as a circuit board passing between the fingers. Each measuring device is calibrated to a zero point by bringing the ends of the movable fingers together and recording the distance or position thereof. Data for computation of substrate thickness and warpage measurements is obtained by recording displacement distances or positions of the movable fingers in contact with opposing surfaces of the substrate with respect to the zero point, the thickness and warpage then being calculated. The apparatus may be integrated with an assembly line, including incorporation with an existing piece of equipment, so that substrates exhibiting out-of-specification thickness or excessive warpage may be reworked, discarded or downgraded during the manufacturing process.