Abstract: Systems, apparatus, articles of manufacture, and methods to perform cloud-based artificial intelligence overclocking are disclosed that, collect workload information, the workload information representing a workload to be executed by the first compute platform, cause generation of an output from an AI model based on the workload information, the output representing an overclocking frequency value to be used for operation of the first compute platform, and performing overclocking based on the overclocking frequency value.

Abstract: Apparatus, systems, and methods for intelligent tuning of overclocking frequency are disclosed. An example apparatus includes trial control circuitry to execute an optimization model to select first values for overclocking parameters of a processor, the first values associated with a first trial, and perform benchmark testing of the processor when the processor is operating based on the first values; trial evaluation circuitry to calculate a first score for the first trial based on the benchmark testing; and model updating circuitry to perform a comparison of the first score to a second score, the second score associated with a second trial for second values for the overclocking parameters, the second values different than the first values; and select one of the first values or the second values to overclock the processor based on the comparison.

Abstract: In one embodiment, a computing device includes a processor, a water block, a thermoelectric cooler, and a thermal space transformer. The thermoelectric cooler is disposed in series between the processor and the water block, and the thermoelectric cooler includes a heated surface and a cooled surface. The heated surface is thermally coupled to the water block, and the cooled surface is thermally coupled to the processor via the thermal space transformer. The thermal space transformer transfers thermal energy between the processor and the cooled surface of the thermoelectric cooler. The thermal space transformer includes a smaller surface and a larger surface. The smaller surface is thermally coupled to the processor and the larger surface is thermally coupled to the cooled surface of the thermoelectric cooler.