Patents by Inventor Rogelio Eduardo ESTRADA

Rogelio Eduardo ESTRADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for improved die bonding
    Patent number: 10756048
    Abstract: Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: August 25, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: José Manuel Flores, Rogelio Eduardo Estrada, Daniel Orozco Mariscal
  • METHODS FOR IMPROVED DIE BONDING
    Publication number: 20200006283
    Abstract: Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.
    Type: Application
    Filed: February 5, 2019
    Publication date: January 2, 2020
    Inventors: José Manuel FLORES, Rogelio Eduardo ESTRADA, Daniel Orozco MARISCAL
  • Method and device for improved die bonding
    Patent number: 10199351
    Abstract: Method and device for improved die bonding. In some embodiments, a bonding device includes a heating element configured to heat air. The bonding device also includes an application element having a plurality of holes configured to apply the heated air to a die, the application element is characterized by an arrangement of the plurality of holes that satisfies one or more directionality criteria. The bonding device further includes a controller configured to control the heating element and to set the temperature of the heated air expelled through the plurality of holes of the application element in order to satisfy one or more bonding criteria.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 5, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: José Manuel Flores, Rogelio Eduardo Estrada, Daniel Orozco Mariscal
  • METHOD AND DEVICE FOR IMPROVED DIE BONDING
    Publication number: 20170194284
    Abstract: Method and device for improved die bonding. In some embodiments, a bonding device includes a heating element configured to heat air. The bonding device also includes an application element having a plurality of holes configured to apply the heated air to a die, the application element is characterized by an arrangement of the plurality of holes that satisfies one or more directionality criteria. The bonding device further includes a controller configured to control the heating element and to set the temperature of the heated air expelled through the plurality of holes of the application element in order to satisfy one or more bonding criteria.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 6, 2017
    Inventors: José Manuel FLORES, Rogelio Eduardo ESTRADA, Daniel Orozco MARISCAL