Patents by Inventor Roger B. Clough

Roger B. Clough has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite solders
    Patent number: 5520752
    Abstract: A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: May 28, 1996
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: George K. Lucey, Jr., James A. Wasynczuk, Roger B. Clough, Jennie S. Hwang