Abstract: A support surface for patient comfort, maintaining a cool skin temperature, or reducing the incidence and promoting the healing of bedsores, includes: (a) a central portion including a hollow, enclosed bladder containing a pre-determined amount of liquid refrigerant with a boiling point between about 23 and about 35 degrees Centigrade; (b) a flexible spacer mechanism contained in the bladder, the spacer mechanism separating an upper bladder wall from a lower bladder wall; and (c) conductive end portions attached to opposite ends of the bladder, the conductive end portions including a flexible heat conductive material layer.

Abstract: A support surface for patient comfort, maintaining a cool skin temperature, or reducing the incidence and promoting the healing of bedsores, includes:

Abstract: Automated article processing, particularly semiconductor wafer processing, is accomplished in a modular article processing machine. The design of the machine allows easy reconfiguration between single and multiple processing station systems. Articles are handled according to a method which easily accommodates the various configurations of the machine and which provides efficient throughput. The machine includes a number of electromechanical and pneumatic systems under the control of at least one microprocessor. Machine state knowledge necessary for startup in the midst of operation, such as following a power interruption, is provided by a mechanical counter indexed at the completion of each stage of operation by the microprocessor controller.

Abstract: An improved pin lift mechanism for plasma processing of semiconductor wafers is disclosed in which the pins are each contained in a non-magnetic tube which is sealed to the wafer chuck. A magnetic slug in each tube couples external motion of a magnet to the pin.

Abstract: A plasma etch process and apparatus is disclosed in which a gas mixture comprises CF.sub.3 Br, xenon or krypton, and oxygen. The plasma reactor includes a sacrificial element, preferably in the form of a graphite ring, on the lower electrode of a parallel plate reactor.

Abstract: A wafer clamp is disclosed in which a high voltage capacitor is formed on a semiconductor wafer, which rests on a conductive support. The plates of the capacitor comprise a plurality of concentric rings formed on the surface of the wafer with alternate rings connected together.

Abstract: Wafer transport in the vacuum portion of an automated wafer processing machine is accomplished by means of an improved transport mechanism. The primary transport device is a rail guided, magnetically driven shuttle plate. Baffles serve to isolate the particle producing portions of the mechanism from the wafers. The major drive components are located inside the rails and outside the vacuum containment system. A pin lift apparatus located on the reactor chucks serves to remove and replace wafers on the shuttle plate. The disclosed apparatus provides efficient and reliable wafer transport with a minimum amount of particulate generation and is easily reconfigurable to single or multiple head machines.

Abstract: A plasma reactor system is described in which modularity is enhanced through automatic shutoff valves for gas lines, enabling components to be exchanged readily. Gas lines are routed through a connector at a predetermined location for all modules. The connector comprises a valve member for each line.