Abstract: Aspects of the disclosure are directed to automatically determining floor planning in chips, which factors in memory macro alignment. A deep reinforcement learning (RL) agent can be trained to determine optimal placements for the memory macros, where memory macro alignment can be included as a regularization cost to be added to the placement objective as a RL reward. Tradeoffs between the placement objective and alignment of macros can be controlled by a tunable alignment parameter.

Abstract: Multiple threshold voltage circuitry based on silicon-on-insulator (SOI) technology is disclosed which utilizes N-wells and/or P-wells underneath the insulator in SOI FETs. The well under a FET is biased to influence the threshold voltage of the FET. A PFET and an NFET share a common buried P-well or N-well. Various types of logic can be fabricated in silicon-on-insulator (SOI) technology using multiple threshold voltage FETs. Embodiments provide circuits including the advantageous properties of both low-leakage transistors and high-speed transistors.

Abstract: Multiple threshold voltage circuitry based on silicon-on-insulator (SOI) technology is disclosed which utilizes N-wells and/or P-wells underneath the insulator in SOI FETs. The well under a FET is biased to influence the threshold voltage of the FET. A PFET and an NFET share a common buried P-well or N-well. Various types of logic can be fabricated in silicon-on-insulator (SOI) technology using multiple threshold voltage FETs. Embodiments provide circuits including the advantageous properties of both low-leakage transistors and high-speed transistors.

Abstract: In various embodiments, each possible different instance of a repeated block can be concurrently modified for chip routing. Repeated blocks can be implemented where all instances of a repeated block are identical or substantially identical. Pin placement may be determined based on analysis of the I/O for all instances. The pin placement may be generated to be identical or substantially similar for all instances. Flyover blockages can be designed into repeated blocks to enable the global router to wire through the repeated block. Buffers and associated pins can be inserted into repeated block within the flyover space where the global router wires to the needed buffer through area pins.

Abstract: In various embodiments, each possible different instance of a repeated block can be concurrently modified for chip routing. Repeated blocks can be implemented where all instances of a repeated block are identical or substantially identical. Pin placement may be determined based on analysis of the I/O for all instances. The pin placement may be generated to be identical or substantially similar for all instances. Flyover blockages can be designed into repeated blocks to enable the global router to wire through the repeated block. Buffers and associated pins can be inserted into repeated block within the flyover space where the global router wires to the needed buffer through area pins.

Abstract: In various embodiments, each possible different instance of a repeated block can be concurrently optimized for timing. Each instance of a repeated block may be treated as a mode, such as a functional mode or testing mode, allowing implementation calculations to be performed simultaneously. Using multimode timing analysis, all instances of a repeated block can be analyzed and optimized simultaneously. Based on the multimode analysis, instances of a repeated block may be implemented identically or substantially similarly, which can reduce costs associated with implementing the same block more than once (e.g., impact to schedule, CPU/memory resources, ECOs).

Abstract: A method for designing integrated circuits includes receiving a floorplan design associated with an integrated circuit. A relative floorplanning constraint is extracted from the floorplan design. The floorplan of the integrated circuit is updated in response to the relative floorplanning constraint. Another method for designing integrated circuits includes receiving a floorplan design associated with an integrated circuit. A set of relative floorplanning constraint is received from the floorplan design. A relative floorplanning constraint is pushed down from the set of relative floorplanning constraints into a partition associated with the floorplan of the integrated circuit. The floorplan is updated in response to the set of relative floorplanning constraints.

Abstract: An electronic design automation method of placing circuit components of an integrated circuit (“IC”) is provided. A synthesized circuit netlist including one or more soft macros is received and a rough global placement of this netlist is performed. A shaper function is determined. The shaper function evaluates a cost of a current placement of the one or more soft macros based on one or more constraints and one or more penalty functions which are associated with the one or more constraints. Moreover, the current placement is optimized to produce a subsequent placement of the one or more soft macros by minimizing the cost. Furthermore, where the netlist includes one or more hard macros, a legalization requirement is applied to the one or more hard macros.

Abstract: A method and system for performing placement-driven physical hierarchy generation in the context of an integrated circuit layout generation system is provided. This generation optimizes the physical hierarchy to improve placement of the cells in the layout, and the associated interconnect routability and delay. A new pre-clustering phase is introduced to maintain as much of the input logical hierarchy as possible while maintaining physical hierarchy quality. And a new cost function is described which is based on measuring the mutual affinity of cells in a virtually-flat placement. The new cost function is used during the new pre-clustering phase, as well as the common clustering, partitioning, and declustering/refinement phases of physical hierarchy generation.