Patents by Inventor Roger Chiu

Roger Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180264466
    Abstract: Methods, systems, and devices are disclosed for culturing and characterizing individual cellular entities including cells organoids, or tissue. In one aspect, a device includes a first substrate structured to include an array of hydrophilic regions surrounded by a hydrophobic surface including nanostructures protruding from the hydrophobic surface, in which the array of hydrophilic regions are capable to adhere an individual cellular entity and the hydrophobic surface is configured to prevent the cellular entity from adherence; and a second substrate including a coating of antibodies corresponding to a type of cellular substance secreted by the cellular entity, in which the second substrate is operable to be placed upon the first substrate such that the coating of antibodies makes contact with the individual cellular entities adhered to the hydrophilic regions.
    Type: Application
    Filed: January 8, 2016
    Publication date: September 20, 2018
    Applicant: The Regents of the University of California
    Inventors: Yu-Hwa Lo, Yu Jui (Roger) Chiu, Wei Cai
  • Patent number: 6400004
    Abstract: A leadless semiconductor package mainly comprises a semiconductor chip disposed on a die pad and electrically connected to a plurality of leads arranged around the die pad. There are a plurality of tie bars connected to the die pad. The lower surface of each lead has an indentation formed corresponding to one of the bottom edges of the package. The semiconductor chip, the leads and the tie bars are encapsulated in a package body wherein the lower surface of each lead is exposed from the bottom surface of the package except the indentation thereof.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: June 4, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Alex Fan, Daniel Chen, Rick Chiu, Jack Kuo, Roger Chiu, Jim Li