Abstract: An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO.

Abstract: Embodiments herein describe error interceptors disposed along a bus that communicatively couples first and second circuits for redirecting in-band errors. That is, the error interceptors can block (or mask) in-band errors so they are not forwarded along the bus. Further, the error interceptors can redirect those errors such that they are converted into out-of-band errors. Moreover, the user can select which error interceptors to activate (e.g., block and redirect the errors) and which to deactivate (e.g., permit the in-band errors to pass). In this manner, the user can control which circuits receive in-band errors and which do not based on whether those circuits can handle the in-band errors.

Abstract: An array of non-volatile memory cells includes rows and columns. A volatile storage circuit provides addressable units of storage. A control circuit reads first type data and second type data from one or more of the rows and multiple ones of the columns of the array of non-volatile memory cells. The control circuit stores the first type data and second type data read from each row in one or more addressable units of storage of the volatile storage. A security circuit reads first data from the one or more of the addressable units of the volatile storage and selects from the first data, the second type data that includes one or more bits of each of the one or more of the addressable units. The security circuit performs an integrity check on the selected second type data, and generates an alert signal that indicates a security violation in response to failure of the integrity check.

Abstract: An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO.

Abstract: An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO of the JTAG controller.

Abstract: A device includes a processor, an SBI, and a plurality of interfaces. The processor is configured to manage operations of the device. The SBI is coupled to the processor. The plurality of interfaces is associated with the SBI. The interfaces of the plurality of interfaces have different interface protocol from one another. The SBI is configured by the processor and the configuration of the SBI activates one interface of the plurality of interfaces at any given time. The active interface that is selected from the plurality of interfaces and a host have a same interface protocol. The active interface is configured to receive host data from the host. The SBI is configured to generate a flag for the processor in response to the active interface receiving the host data. The SBI is configured to transmit device data to the host.

Abstract: An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO of the JTAG controller.

Abstract: A device includes a plurality of memory components with redundant columns associated therewith, a sub-block controller, and a volatile memory. The sub-block controller generates a repair vector, during manufacture testing mode. The repair vector is associated with the plurality of memory components and is generated responsive to detecting a defect within a column of the plurality of memory components. No repair vector is generated responsive to detecting no defect within a column of the plurality of memory components. The volatile memory receives and stores the repair vector in a nonvolatile memory component, during the manufacture testing mode. The volatile memory receives the repair vector from the nonvolatile memory component if the repair vector was generated during the manufacture testing mode, at startup mode, and provides it to the sub-block controller. The sub-block controller loads a repair data into the plurality of memory components based on the repair vector.

Abstract: A system generally relating to an SoC, which may be a field programmable SoC (“FPSoC”), is disclosed. In this SoC, dedicated hardware includes a processing unit, a first internal memory, a second internal memory, an authentication engine, and a decryption engine. A storage device is coupled to the SoC. The storage device has access to a boot image. The first internal memory has boot code stored therein. The boot code is for a secure boot of the SoC. The boot code is configured to cause the processing unit to control the secure boot.

Abstract: A method relating generally to loading a boot image is disclosed. In such a method, a header of a boot image file is read by boot code executed by a system-on-chip. It is determined whether the header read has an authentication certificate. If the header has the authentication certificate, authenticity of the header is verified with the first authentication certificate. It is determined whether the header is encrypted. If the header is encrypted, the header is decrypted.

Abstract: A programmable IC is disclosed that includes a programmable logic sub-system, a processing sub-system, and a safety sub-system. The programmable logic circuits in the programmable logic sub-system are configured to form a set of circuits indicated in a set of configuration data. The processing sub-system also executes a software program included in the set of configuration data. The programmable logic sub-system and the processing sub-system are independently powered. In response to a power failure of the processing sub-system and continued power to the programmable logic sub-system, the safety sub-system resets only the processing sub-system. In response to a power failure of the programmable logic sub-system and continued power to the processing sub-system, the safety sub-system resets only the programmable logic sub-system.

Abstract: A programmable integrated circuit device (IC) can include a configuration controller configured to assert a suspend request signal responsive to an input triggering suspend mode within the programmable IC and a memory controller block coupled to the configuration controller and a memory device. The memory controller block can be configured to place the memory device in self refresh mode in response to the suspend request signal and assert a suspend acknowledgement signal subsequent to placing the memory device in self refresh mode. The configuration controller can continue implementing suspend mode within the programmable IC in response to assertion of the suspend acknowledgement signal.

Abstract: A technique applicable during the transfer of data to and from a memory involves: operating a memory interface using memory access cycles that each transfer a quantity of data D across the memory interface; receiving a request to transfer a quantity of data Q across the memory interface; and calculating a value M as a function of a plurality of parameters, M being a minimum number of the memory access cycles needed to carry out the transfer of the quantity of data Q across the memory interface, wherein the calculating includes determining a logarithm of one of the parameters, and then determining the value M as a function of the logarithm.

Abstract: A technique is provided that involves: configuring a clock generation circuit to output a first signal having a first frequency that is one of a plurality of frequencies that are different; generating in a clock section of a further circuit as a function of the first signal a second signal having a second frequency that is one of the plurality of frequencies other than the first frequency; and configuring the clock section to supply to the further circuit a clock signal that is one of the first and second signals.

Abstract: An embodiment of a technique to transfer data includes: operating a memory interface using memory access cycles that each include T successive time slots each provided for transfer of B bits of data, where T and B are positive integers; selecting one of first or second predetermined integers as one of T or B; and transferring a quantity of data Q between the memory interface and another interface. The transferring includes: automatically determining a value of M memory access cycles as a function of the one of T or B; causing a data transfer sequence on the memory interface that includes M successive memory access cycles and thus M·T time slots; automatically determining a subset of the M·T time slots as a function of the one of T or B; and transferring the quantity of data Q through the memory interface during the subset of time slots.

Abstract: A technique is applicable to a device having programmable circuitry that includes a first interface having a plurality of first address terminals, a second interface having a plurality of second address terminals, and a configurable interconnect structure coupled between the first and second interfaces. The technique includes configuring the interconnect structure during field programming to electrically couple each of the address terminals in a first subset of the first address terminals to respective address terminals in a second subset of the second address terminals according to a selected one of a plurality of different mapping functions.