Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Abstract: A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a copper substrate comprises providing a printed wiring board having a copper substrate and contacting the copper substrate with phosphate ions, and an oxidizer. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.

Abstract: A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a copper substrate comprises providing a printed wiring board having a copper substrate and contacting the copper substrate with phosphate ions, and an oxidizer. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.

Abstract: The current method and composition relate to depositing silver onto a metal surface using an acid selected from the group consisting of salicylic acid and salicylic acid derivatives; a source of silver ions; and an additive selected from the group consisting of polyethylene glycol, a block copolymer of polyethylene glycol and polypropylene glycol, polypropylene glycol, block copolymers based on ethylenediamine as a core derivatives of any of the foregoing and mixtures of any of the foregoing.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: A method for preventing a carbon dispersion from increasing in viscosity during use is described. The dispersion comprises graphite particles or carbon black particles or a combination of both dispersed in a fluid. The method involves lowering the susceptibility of the carbon dispersion to an increase in viscosity or ionic strength by lowering its pH or reducing its exposure to reactive components in the ambient atmospheric gas. The pH can be lowered by at least partially removing ammonia from the dispersion, or by adding a material that reduces the pH of the dispersion. The stability of the dispersion can also be improved by isolating the dispersion from reactive atmospheric gas. The stabilized aqueous carbon dispersion can have a viscosity of less than about 20 cps and a conductivity of less than about 3 mS.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: A method for preventing a carbon dispersion from increasing in viscosity during use is described. The dispersion comprises graphite particles or carbon black particles or a combination of both dispersed in a fluid. The method involves lowering the susceptibility of the carbon dispersion to an increase in viscosity or ionic strength by lowering its pH or reducing its exposure to reactive components in the ambient atmospheric gas. The pH can be lowered by at least partially removing ammonia from the dispersion, or by adding a material that reduces the pH of the dispersion. The stability of the dispersion can also be improved by isolating the dispersion from reactive atmospheric gas. The stabilized aqueous carbon dispersion can have a viscosity of less than about 20 cps and a conductivity of less than about 3 mS.

Abstract: An apparatus and method for applying a fluid to the through holes, vias, or other recesses of a printed wiring board is disclosed. The apparatus is a roller assembly. The roller comprises a cover and an interior portion and is supported by a mounting. A fluid supply provides treatment fluid to the interior portion. A feed transports a board into contact with the roller. The method is carried out by transporting fluid to the interior portion of the roller. The fluid then passes from the interior portion to the cover. A board is transported into contact with the roller assembly. Upon contact with a board, the roller cover deforms so that it distributes fluid across the board and pushes the fluid into the board's recesses. The roller assembly quickly receives and coats printed wiring boards while penetrating and coating recesses with high aspect ratios using minimal amounts of treatment fluid.

Abstract: A method for preventing a carbon dispersion from increasing in viscosity during use is described. The dispersion comprises graphite particles or carbon black particles or a combination of both dispersed in a fluid. The method involves lowering the susceptibility of the carbon dispersion to an increase in viscosity or ionic strength by lowering its pH or reducing its exposure to reactive components in the ambient atmospheric gas. The pH can be lowered by at least partially removing ammonia from the dispersion, or by adding a material that reduces the pH of the dispersion. The stability of the dispersion can also be improved by isolating the dispersion from reactive atmospheric gas. The stabilized aqueous carbon dispersion can have a viscosity of less than about 20 cps and a conductivity of less than about 3 mS.

Abstract: A process and catalyst for electroless plating of metal over a substrate. The process involves providing a catalyst that is the product of reaction of a noble metal with bromide ions where the ratio of bromide ions to noble metal ions is at least 100 to 1 and the noble metal is present in a concentration sufficient to catalyze an electroless plating reaction, contacting a substrate to be plated with the catalyst, and reducing the catalyst prior to or during plating of the substrate.

Abstract: Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.