Patents by Inventor Roger Nattkemper

Roger Nattkemper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9060436
    Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: June 16, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric R. Daniel
  • Publication number: 20130208410
    Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.
    Type: Application
    Filed: October 28, 2010
    Publication date: August 15, 2013
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric R. Daniel
  • Patent number: 7544072
    Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: June 9, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric Daniel
  • Publication number: 20090111293
    Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.
    Type: Application
    Filed: October 29, 2007
    Publication date: April 30, 2009
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric Daniel