Patents by Inventor Roger Schenk

Roger Schenk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8701267
    Abstract: A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: April 22, 2014
    Assignee: Authentec, Inc.
    Inventors: Michael P. Goldenberg, Roger Schenk, Phil Spletter, Yang Rao
  • Publication number: 20120112764
    Abstract: A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 10, 2012
    Applicant: AuthenTec, Inc., State of Incorporation: Delaware
    Inventors: Michael P. Goldenberg, Roger Schenk, Phil Spletter, Yang Rao