Abstract: A method for forming an electronic device provides a carrier formed from a composite material comprising a plastic binder and an embedded material. A substrate material is attached to the carrier. The substrate is processed to form the electronic device thereon. The substrate is then detached from the carrier to yield the resultant electronic device.

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract: A method for forming an electronic device provides a carrier formed from a composite material comprising a plastic binder and an embedded material. A substrate material is attached to the carrier. The substrate is processed to form the electronic device thereon. The substrate is then detached from the carrier to yield the resultant electronic device.

Abstract: A method for forming an electronic device on a flexible substrate conditions the surface of a carrier to form a holding area for retaining the flexible substrate. A contact surface of the flexible substrate is applied against the carrier with an intermediate binding material applied between at least the holding area of the carrier and the corresponding area of the contact surface. Entrapped gas between the flexible substrate and the carrier is removed and the substrate processed to form the electronic device thereon. The substrate can then be removed from the holding area to yield the resultant electronic device.

Abstract: A method for forming an electronic device provides a metallic carrier having a retaining surface and secures a contact surface of a metallic substrate material against the retaining surface of the metallic carrier. The substrate is processed to form the electronic device thereon; and the metallic substrate material released from the metallic carrier, to yield the completed electronic device.

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract: A radiographic imaging device has a first scintillating phosphor screen having a first thickness and a second scintillating phosphor screen having a second thickness. A transparent substrate is disposed between the first and second screens. An imaging array formed on a side of the substrate includes multiple photosensors and an array of readout elements.

Abstract: A radiographic imaging device has a first scintillating phosphor screen having a first thickness and a second scintillating phosphor screen having a second thickness. A transparent substrate is disposed between the first and second screens. An imaging array formed on a side of the substrate includes multiple photosensors and an array of readout elements.

Abstract: An imaging processor for receiving a medium for processing, the processor comprises an imaging drum having a rigidly attached lip portion for receiving an edge of the medium; and a movable stop disposed on and magnetically attracted toward the imaging drum for receiving a second edge of the medium for permitting the retention of medium of various dimensions.

Abstract: Image processing equipment(100) has a thermally activated write head element (200) that builds up heat during operations and an improved heat exchanger assemblage (300) having a high surface area heat sink (312) that absorbs and then dissipates the heat. Heat exchanger (300), structurally connected to the write head element (200), includes an air moving means (304) having a backward curved impeller (306) driven by a compact planar de motor for producing higher impeller speeds with superior thermal transfer performance.

Abstract: An improved heat exchanger (10) has a heat sink (22) with fins (24) having a very high heat transfer coefficient structurally associated with a compact, high air velocity air moving means (14). Air moving means (14) of the invention employs a backward curved impeller (16) driven by a compact planar dc motor (50) adapted to yield higher than normal impeller speeds with superior thermal transfer performance.

Abstract: Apparatus for superposing a receiver sheet and a donor sheet on an imaging drum communicates vacuum from the interior of the drum to the exterior surface. A leading edge of a receiver sheet is advanced into alignment with a predetermined position on the drum surface while being held radially off of the drum surface. The drum is rotated to thereby draw the receiver sheet into contact with the drum surface. Next, a leading edge of a donor sheet is advanced into alignment with a predetermined position on the drum surface while being held radially off of the drum surface. The drum is again rotated to thereby draw the donor sheet into contact with the drum surface. The leading edge of the receiver sheet and the donor sheet are held radially off of the drum surface until aligned with the predetermined position, and thereupon is lowered radially onto the drum surface.