Patents by Inventor Roger Tietze
Roger Tietze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9580577Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.Type: GrantFiled: March 2, 2011Date of Patent: February 28, 2017Assignee: HUNTSMAN INTERNATIONAL LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 9512333Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, molded articles, adhesives and coatings.Type: GrantFiled: April 18, 2013Date of Patent: December 6, 2016Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 9416271Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: GrantFiled: January 27, 2015Date of Patent: August 16, 2016Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20150147508Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: ApplicationFiled: January 27, 2015Publication date: May 28, 2015Inventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 9012543Abstract: The instant invention relates to 3,3?-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazin-6-yl)-1(3H)-isobenzofuranone and analogues based on phenolphthalein, formaldehyde and a primary amine. Such compounds are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compounds may especially be used in the production of printed wiring boards.Type: GrantFiled: September 27, 2005Date of Patent: April 21, 2015Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Dave Orser, Yefim Blyakhman, Mark Bryant, Bor-Sheng Lin
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Patent number: 8975318Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: GrantFiled: February 20, 2009Date of Patent: March 10, 2015Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 8853302Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.Type: GrantFiled: May 14, 2010Date of Patent: October 7, 2014Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
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Publication number: 20140057086Abstract: The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.Type: ApplicationFiled: May 9, 2012Publication date: February 27, 2014Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20130231021Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: ApplicationFiled: April 18, 2013Publication date: September 5, 2013Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 8445699Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: GrantFiled: March 16, 2010Date of Patent: May 21, 2013Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20120318571Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.Type: ApplicationFiled: March 2, 2011Publication date: December 20, 2012Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20120046388Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.Type: ApplicationFiled: May 14, 2010Publication date: February 23, 2012Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
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Publication number: 20120003892Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: ApplicationFiled: March 16, 2010Publication date: January 5, 2012Applicant: Huntsman Advanced Materials Americans LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20110152453Abstract: The instant invention relates to 3,3?-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazin-6-yl)-1(3H)-isobenzofuranone and analogues based on phenolphthalein, formaldehyde and a primary amine. Such compounds are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compounds may especially be used in the production of printed wiring boards.Type: ApplicationFiled: September 27, 2005Publication date: June 23, 2011Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Roger Tietze, Dave Orser, Yeflm Blyakhman, Mark Bryant, Bor-Sheng Lin
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Publication number: 20100330287Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: ApplicationFiled: February 20, 2009Publication date: December 30, 2010Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20100059174Abstract: The instant invention relates to boroxine derived compounds, for example tripropargylboroxine, the preparation of said compounds and the use as flame retardant in polymeric resins, in particular in thermosetting polymeric resins.Type: ApplicationFiled: February 23, 2006Publication date: March 11, 2010Applicant: HUNTSMAN ADVANCED MATERIALS AMERICAS INC.Inventors: Roger Tietze, Dave Orser, Yefim Blyakhman, Mark Bryant, Bor-Sheng Lin, Ulrich Weidmann
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Patent number: 5637387Abstract: The present invention relates to storage-stable advanced polymaleimide compositions and prepreg products manufactured therefrom comprising (A) an advanced polymaleimide reaction product resulting from the advancement reaction of a polyimide and an alkenyl phenol; and (B) a phenothiazine added to component (A) after advancement.Type: GrantFiled: June 2, 1995Date of Patent: June 10, 1997Assignee: Ciba-Geigy CorporationInventors: Benjamin G. Chin, Roger Tietze
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Patent number: 5240981Abstract: The present invention relates to a polyimide resin composition and products, especially storage stable polyimide pre-pregs, manufactured therefrom with improved processing properties comprising (A) the reaction product of a polyimide, an alkenylphenol or an alkenylphenol ether, and tribromophenyl-maleimide, (B) an ionic or free-radical polymerization catalyst and (C) phenothiazine derivatives.Type: GrantFiled: June 3, 1991Date of Patent: August 31, 1993Assignee: Ciba-Geigy CorporationInventors: Benjamin G. Chin, Roger Tietze