Abstract: To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Abstract: Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.

Abstract: Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.

Abstract: The invention relates to an LED lamp comprising at least one LED as the luminaire, a ceramic base and a ceramic supporting body, arranged on the base and having a supporting surface for accommodating the LEDs, and further comprising a light-permeable lampshade which is fixed on the supporting body and put on the supporting surface, sintered metalized sections, which form a circuit board, being arranged on the supporting surface for the LEDs to be soldered to and optionally for applying a corresponding circuit thereto. In order for the light emitted by the LEDs to be influenced and guided by simple means, the lampshade has a cupola, dome or bonnet design and consists of glass or plastic.

Abstract: In order to extend the life and reduce the fitting complexity involved, what is proposed is: the light-emitting unit comprises a plurality of individual identical cooling apparatus/light-emitting means modules (3), which are connected for form clusters (5), wherein each cooling apparatus/light-emitting means module (3) comprises a ceramic carrier body (1), which has, on one or more of its surfaces, sintered metallization regions (7), said metallization regions (9) forming a printed circuit board, to which one or more LEDs (2) is/are electrically conductively connected.

Abstract: Coil bodies having a ceramic core.

Abstract: A process for producing a plate from a brittle material Which can be individually separated by breaking to form one or more smaller platelets. In this process, laser scoring is used to produce in a single plate of large dimensionsa parallel first predetermined breaking points respectively at the distance d.sub.a andb parallel second predetermined breaking points respectively at the distance d.sub.b,which intersect the first predetermined breaking points, a and b being integers over 1. The edge zone is removed in the outer region at the distance d.sub.a from the two outer first predetermined breaking points and at the distance d.sub.b from the two outer second predetermined breaking points, so that the remaining plate, without border pieces, contains (a-1).times.(b-1) platelet sections of the same size, which are bounded by in each case four predetermined breaking points.