Patents by Inventor Roland M. Lynch

Roland M. Lynch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230374315
    Abstract: The disclosure relates to compositions and methods useful for treating a substrate, for example for preventing or inhibiting corrosion of metal substrates. The compositions comprise (a) at least one cross-linkable, partially hydrolyzed polymer, and (b) at least one particular crosslinking agent.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Roland M. LYNCH, Morris N. Newsom, JR.
  • Publication number: 20210212934
    Abstract: Methods and compositions for providing long term pain relief in, for example, surgery recovery, including injecting a composition comprising a plurality of microparticles having different sizes and at least one local anesthetic loaded into the microparticles at different loading levels. Extended prolonged blockage of nerve action in sheep testing was confirmed. Some of the microparticles comprise a high loading of local anesthetic. Testing in sheep showed nerve blockage for at least six days.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 15, 2021
    Applicant: CAPSULATED SYSTEMS, INC.
    Inventors: Roland M. LYNCH, Lwandiko E. MASINDE
  • Publication number: 20200085732
    Abstract: Methods and compositions for providing long term pain relief in, for example, surgery recovery, including injecting a composition comprising a plurality of microparticles having different sizes and at least one local anesthetic loaded into the microparticles at different loading levels. Extended prolonged blockage of nerve action in sheep testing was confirmed. Some of the microparticles comprise a high loading of local anesthetic. Testing in sheep showed nerve blockage for at least six days.
    Type: Application
    Filed: August 23, 2019
    Publication date: March 19, 2020
    Applicant: CAPSULATED SYSTEMS, INC.
    Inventors: Roland M. LYNCH, Lwandiko E. MASINDE
  • Publication number: 20110081422
    Abstract: Methods and compositions for providing long term pain relief in, for example, surgery recovery, including injecting a composition comprising a plurality of microparticles having different sizes and at least one local anesthetic loaded into the microparticles at different loading levels. Extended prolonged blockage of nerve action in sheep testing was confirmed. Some of the microparticles comprise a high loading of local anesthetic. Testing in sheep showed nerve blockage for at least six days.
    Type: Application
    Filed: November 18, 2008
    Publication date: April 7, 2011
    Inventors: Roland M. Lynch, Lwandiko E. Masinde
  • Patent number: 6004417
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 21, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5877236
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: March 2, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5824724
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: October 20, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5821293
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: October 13, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch