Abstract: A buckling beam test probe assembly for the electrical test of integrated circuit devices is provided having contact probes made of a composite material and a stripper plate constructed so as to allow scrubbing and controllable wiping of the contact probe on the surface of the device to be tested. The assembly is designed for the maximum number of expected contact probes. Only the contact probe compartments which are needed for testing the devices are populated.

Abstract: A contact probe assembly is described comprising a motor-driven fine positioning means. The fine positioning means permits the contact probe assembly to move in two directions X and Y which are perpendicular to each other. For positioning several contact probe assemblies, provided with fine positioning means, closely adjacent to each other, the longitudinal axis of each fine positioning means extends perpendicularly to the plane defined by the X and the Y direction. An electromotor is provided for either direction of movement. In one embodiment, fine positioning in either direction is effected by a perpendicularly arranged hollow shaft, the lower end of which is eccentrically shaped, reciprocally moving a carrier slide which is permanently connected to the contact probe assembly. The hollow shaft for moving the contact probe assembly in the Y direction is arranged inside the hollow shaft for movement in the X direction. The travel performed is detected by sensors.