Abstract: Disclosed herein are devices, systems, and methods for gas distribution in a coating process. The system may determine information representing a spatial distribution of a material vapor flow emitted from a plurality of emission nozzles. The system may control a regulator configured to affect, based on the information, a gas flow superposed on the material vapor flower. In this manner, it may be easier to counteract disturbances in the spatial distribution with which the material vapor flow exits from the plurality of emission nozzles, disturbances due to, for example, variations in the characteristics of the emission nozzles, flow-related variations in the tube, finite tube length, and the like.

Abstract: A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided.

Abstract: A magnetron arrangement includes a hollow target and a magnet system arranged in the hollow target with a magnet carrier and a magnet arrangement fitted on the magnet carrier. The magnet carrier includes at least two magnet carrier elements, which each have at least one cavity and each have at least one contact face on an outer side. The at least two magnet carrier elements are in touching contact with their contact faces and are fixedly connected to one another, and the cavities of the magnet carrier elements have no connection between them.