Patents by Inventor Romano Schmidt

Romano Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer probe resumption of die testing
    Patent number: 10955468
    Abstract: Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: March 23, 2021
    Assignee: Texas Instruments Incorporated
    Inventors: Joseph Anthony Boduch, Romano Schmidt
  • Wafer Probe Resumption of Die Testing
    Publication number: 20190227116
    Abstract: Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.
    Type: Application
    Filed: January 22, 2019
    Publication date: July 25, 2019
    Inventors: Joseph Anthony Boduch, Romano Schmidt