Abstract: A top case assembly for a portable computer is disclosed. The assembly may include an integral unified (e.g., homogenous) top case formed from a single part. The integral top case provides an enclosure, frame and cosmetic exterior of the portable computer. The integral top case also serves as the primary structure of the portable computer. The assembly may include a variety of subassemblies such as keyboards, touchpads, circuit boards, and drives that are carried by the underside of the integral top case. The integral top case may be formed from aluminum slab that has been machined to form walls, openings, attachment areas and cosmetic areas of the top case.

Abstract: A multipart computer housing is described. The multipart computer housing includes at least a structural support layer and a body. The body includes at least an outer layer formed of lightweight flexible material and an inner layer attached to the outer layer. The inner layer is connected to the support layer forming a load path between the inner layer and the structural support layer. A load applied to the multipart computer housing is transferred by way of the load path to the support layer without substantially affecting the outer layer.

Abstract: A multipart computer housing is described. The multipart computer housing includes at least a clutch barrel. The clutch barrel encloses a connector assembly, the connector assembly providing support for a lid. The clutch barrel is configured such that a junction formed by the clutch barrel and a top layer of the lid is not visible to a user when the computer housing is on a horizontal surface.

Abstract: A multipart computer housing is described. The multipart computer housing includes at least a structural support layer and a body. The body includes at least an outer layer formed of lightweight flexible material and an inner layer attached to the outer layer. The inner layer is connected to the support layer forming a load path between the inner layer and the structural support layer. A load applied to the multipart computer housing is transferred by way of the load path to the support layer without substantially affecting the outer layer.

Abstract: A portable computing device having a substantially non-conducting outer housing and alternative electrical grounding and audio system architectures is disclosed. The device can be a laptop computer having a main logic board, a keyboard assembly, an audio source positioned below the keyboard assembly, and an equalizer electrically coupled to the audio source, with each of these components being electrically coupled to a universal grounding structure. The audio source emits sound waves that are propagated through the keyboard assembly and between gaps between keyboard keys and the outer housing. Settings for the equalizer can be selected to account for sound absorption and amplification characteristics of the sound waves along these sound transmission paths.

Abstract: By being embedded in a portable computing device, a battery pack is made essentially inaccessible to unauthorized users, thereby allowing for a battery pack that can be made smaller and of lighter construction material, thereby facilitating greater component density within the portable computing device, lower cost to manufacture, and more environmentally secure. In another embodiment, the battery pack can take the form of a battery assembly formed of a single piece housing having a cantilever portion to provide additional stiffness.

Abstract: By being embedded in a portable computing device, a battery pack is made essentially inaccessible to unauthorized users, thereby allowing for a battery pack that can be made smaller and of lighter construction material, thereby facilitating greater component density within the portable computing device, lower cost to manufacture, and more environmentally secure.

Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.

Abstract: A top case assembly for a portable computer is disclosed. The assembly may include an integral unified (e.g., homogenous) top case formed from a single part. The integral top case provides an enclosure, frame and cosmetic exterior of the portable computer. The integral top case also serves as the primary structure of the portable computer. The assembly may include a variety of subassemblies such as keyboards, touchpads, circuit boards, and drives that are carried by the underside of the integral top case. The integral top case may be formed from aluminum slab that has been machined to form walls, openings, attachment areas and cosmetic areas of the top case.

Abstract: Portable computer structures are provided. The portable computer structures may include connector structures. The portable computer may have a case. A portion of the connector structure may be formed by the case of the portable computer. The portable computer may have a circuit board with grounding spring-loaded pins which electrically ground the circuit board to the case of the portable computer. The portable computer may have an optical disk drive that is form fitted to mount to the portable computer case.

Abstract: Portable computer structures are provided. The portable computer structures may include speaker grill structures. A speaker grill structure may be formed by creating an array of small holes (perforations) in a portable computer housing structure such as a planar housing wall. A speaker may be mounted adjacent to the array of holes. The planar housing wall may be formed in a block of milled aluminum and may have a thickness of less than 1 mm. The speaker holes may have with small diameters without overly attenuating sound from a speaker.

Abstract: Portable computer structures are provided. The portable computer structures may include hard drive mounting structures. The hard drive mounting structures may include elastomeric support members. Each elastomeric support member may have a relatively rigid inner portion. The inner portion may include a hole that receives a hard drive mounting pin. Each elastomeric support member may also have a relatively flexible outer portion. The relatively flexible outer portion may be mounted within an opening in a plastic support member. The rigid inner portion may have a square outline and may be mounted within a square opening in the flexible outer portion.

Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.