Abstract: A method for wave soldering comprises the steps of providing a circuit board having a plurality of electronic components thereon and providing a pallet comprising a frame, first and second parallel rails attached to the frame, and third and fourth rails for receiving the circuit board. The third and fourth rails are attached to the first and second rails and the third and fourth rails form an angle of between about 30.degree. and 60.degree. with the first and second rails. Next, a solder wave is provided which generally flows in a first direction. Finally, the pallet is moved in a second direction generally perpendicular with the first direction across the solder wave. The components are therefore positioned at an angle with respect to the solder wave and solder-related electrical defects are reduced.

Abstract: A pallet for holding a printed circuit board comprises first and second parallel rails and third and fourth parallel rails. The third and fourth rails each have first and second ends and form an angle of between about 30.degree. and 60.degree. with the first and second rails. The first and second ends of the third and fourth rails are connected to one of the first and second rails. The pallet further comprises an attachment for securing the printed circuit board to the third and fourth rails. The angled pallet has advantages over conventional pallets as shorts and shadowing are reduced.