Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: According to the invention, an electronic module tester for engaging a camera module is disclosed. The electronic module tester includes a camera tester body, an engagement ring, and a camera back support. The engagement ring engages a lens holder of the camera module, where the engagement ring comprises an engagement surface, an outer circumference and an inner circumference. The engagement surface rotates and is not keyed for any key on the lens holder. The camera back support engages a back of the camera module, where the back is on the opposite side of camera module as the lens holder. The engagement ring and the camera back support are separated, but biased together to engage the camera module.

Abstract: According to the invention, an electronic module tester for engaging a camera module is disclosed. The electronic module tester includes a camera tester body, an engagement ring, and a camera back support. The engagement ring engages a lens holder of the camera module, where the engagement ring comprises an engagement surface, an outer circumference and an inner circumference. The engagement surface rotates and is not keyed for any key on the lens holder. The camera back support engages a back of the camera module, where the back is on the opposite side of camera module as the lens holder. The engagement ring and the camera back support are separated, but biased together to engage the camera module.

Abstract: A signage display attachment system for mounting a sign to a substrate is disclosed. The signage display attachment system comprises a frame having a pair of vertical sides and a pair of horizontal sides. Each pair comprises a pair of base plates mounted to a substrate and a corresponding pair of tensioning plates having a plurality of recesses thereon. Each of the plurality of recesses is an elongated rounded trench shape. Further, each of the tensioning plates is adapted to mount to the pair of base plates. A securing device is adapted to releaseably hold the tensioning plate to the base plate. An insertion bead mounted to the edge of a sign is adapted to engage one of the plurality of recesses.

Abstract: A signage display attachment system for mounting a sign to a substrate is disclosed. The signage display attachment system comprises a frame having a pair of vertical sides and a pair of horizontal sides. Each pair comprises a pair of base plates mounted to a substrate and a corresponding pair of tensioning plates having a plurality of recesses thereon. Each of the plurality of recesses is an elongated rounded trench shape. Further, each of the tensioning plates is adapted to mount to the pair of base plates. A securing device is adapted to releaseably hold the tensioning plate to the base plate, An insertion bead mounted to the edge of a sign is adapted to engage one of the plurality of recesses.