Abstract: A process of film resistor laser trimming. The process involves coating a resistor prior to trimming with a removable insulative material which absorbs and traps trimming debris, thus minimizing or preventing deposition of same on the trimmed resistor surface. Formation of conductive paths otherwise created over the surface of the resistor by the trimming debris is precluded thereby, thus enabling greater accuracy with respect to trimmed resistor measurement. The coating used is a composition of phenyl polysiloxane with silica dispersed therein.