Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. The via support may have a cavity filled by BARC layers.

Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. In an example micromirror device, metal layers define a movable mirror member supported on a via support which has a cavity filled by BARC layers. The BARC layers are planarized to a planar portion of a first metal layer and a second metal layer is formed over the first metal layer planar portion and planarized BARC layer plug.

Abstract: In a lithography process using an ultraviolet process, the applied ultraviolet resist can be removed by intentionally condensing the ultraviolet resist before removing the ultraviolet resist.

Abstract: A manufacturing process including a controller method to generate a tool setting which includes a tool offset and a device offset. The controller method uses a device parameter measurement to update the tool offset and device offset. A tool weight and a device weight is assigned so that only one of the tool offset and device offset is significantly changed during the update. The process may be applied to semiconductor device manufacturing and particularly to integrated circuit fabrication.

Abstract: A manufacturing process including a controller method to generate a tool setting which includes a tool offset and a device offset. The controller method uses a device parameter measurement to update the tool offset and device offset. A tool weight and a device weight is assigned so that only one of the tool offset and device offset is significantly changed during the update. The process may be applied to semiconductor device manufacturing and particularly to integrated circuit fabrication.

Abstract: Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing the developed resist layer, and cleaning the developed resist layer with a developer solution to remove contaminants. The cleaning makes use of the same developer solution used to develop the resist layer, so the cleaning makes use of a process that already exists and requires no additional investment to implement, while the curing stabilizes the developed resist layer so that the cleaning does not damage the developed resist layer.

Abstract: In a lithography process using an ultraviolet process, the applied ultraviolet resist can be removed by intentionally condensing the ultraviolet resist before removing the ultraviolet resist.

Abstract: Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing the developed resist layer, and cleaning the developed resist layer with a developer solution to remove contaminants. The cleaning makes use of the same developer solution used to develop the resist layer, so the cleaning makes use of a process that already exists and requires no additional investment to implement, while the curing stabilizes the developed resist layer so that the cleaning does not damage the developed resist layer.

Abstract: System and method for maximizing image quality by eliminating vias on a reflective surface. A preferred embodiment comprises depositing a first portion of a mirror surface over a support surface, applying a protective coating on the mirror surface, and then inverting the via. The preferred embodiment also comprises removing a portion of the inverted via and then depositing a second portion of the mirror surface. The remaining portion of the inverted via fills the via and provides a level surface for the depositing of the second portion of the mirror surface, reducing the amount of light scattered by the via.

Abstract: System and method for maximizing image quality by eliminating vias on a reflective surface. A preferred embodiment comprises depositing a first portion of a mirror surface over a support surface, applying a protective coating on the mirror surface, and then inverting the via. The preferred embodiment also comprises removing a portion of the inverted via and then depositing a second portion of the mirror surface. The remaining portion of the inverted via fills the via and provides a level surface for the depositing of the second portion of the mirror surface, reducing the amount of light scattered by the via.