Abstract: In making electronic components, it is often necessary to bond a lead frame to an insulating substrate. In carrying out the bonding, it is desirable to provide compensation to prevent cracking of the substrate. At the same time it is also desirable to prevent relative motion between the substrate and lateral guides for accurately positioning the substrate with respect to a bonding tip. The prevention of such motion reduces the likelihood of damage to the guides. To these ends, the substrate is positioned on a supporting pedestal and on the first ends of a plurality of elongated members or rods slidable through the pedestal and having second ends mounted to spring elements. In so positioning the substrate, it is located between lateral guides which are fixed to the pedestal. Prior to bonding, the surface of the pedestal is urged flush with the surfaces of the first ends of the rods. Then, during bonding the pedestal is moved with the guides and the substrate.