Patents by Inventor Ronald F. Buczak

Ronald F. Buczak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder pack and method of manufacture thereof
    Patent number: 4209893
    Abstract: A solder pack consists of a thin heat resistant carrier board having spaced holes therethrough in which are held solder rings. The solder pack is, for example, placed over pins supported in correspondingly spaced holes in a printed circuit board so that each pin protrudes through an associated solder ring in the solder pack. Heat is applied to melt the solder rings to solder the pins to the printed circuit board. Two representative means for manufacturing solder packs are disclosed.
    Type: Grant
    Filed: October 24, 1978
    Date of Patent: July 1, 1980
    Assignee: The Bendix Corporation
    Inventors: John W. Dyce, Ronald F. Buczak