Abstract: A method and a non-transient computer readable medium for sorting orders to be run on a multi-section slitter/scorer at a corrugator dry end includes collecting specifications of orders in current, prior, and/or subsequent paper group queues. Run times and slit/score head recovery times for orders in the current paper group queue are calculated using the specifications. Those orders for which recovery time exceeds run time are flagged as short orders. For a given short order, pairs of preceding and following orders that would require recovery times less than the short order's run time are determined and flagged as potential bracketing pairs. The current paper group queue is searched to determine if a bracketing pair can be formed from its orders, and if so, the orders in the current paper group queue are reorganized such that the orders in the bracketing pair immediately precede and follow the given short order.

Abstract: A method and a non-transient computer readable medium for sorting orders to be run on a multi-section slitter/scorer at a corrugator dry end includes collecting specifications of orders in current, prior, and/or subsequent paper group queues. Run times and slit/score head recovery times for orders in the current paper group queue are calculated using the specifications. Those orders for which recovery time exceeds run time are flagged as short orders. For a given short order, pairs of preceding and following orders that would require recovery times less than the short order's run time are determined and flagged as potential bracketing pairs. The current paper group queue is searched to determine if a bracketing pair can be formed from its orders, and if so, the orders in the current paper group queue are reorganized such that the orders in the bracketing pair immediately precede and follow the given short order.

Abstract: A method and apparatus for performing an order change in a corrugator uses a minimum slit head configuration with all slit heads carried on two sides of a single tool support structure. A single robot is operable on the support structure to independently reset the positions of slit heads during a running order to prepare for subsequent order change in a most efficient manner, utilizing order scheduling that eliminates order changes that cannot be formed with the minimum slit head configuration.

Abstract: A method and apparatus for performing an order change in a corrugator uses a minimum slit head configuration with all slit heads carried on two sides of a single tool support structure. A single robot is operable on the support structure to independently reset the positions of slit heads during a running order to prepare for subsequent order change in a most efficient manner, utilizing order scheduling that eliminates order changes that cannot be formed with the minimum slit head configuration.

Abstract: A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor.

Abstract: A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.

Abstract: A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor.

Abstract: A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.