Abstract: A tray includes adjustably positioned support members for supporting multiple lead integrated circuit components of various sizes and configurations. The components are supported by the support members so that the component leads do not make contact with said support members. A cover is disposed on the tray to protect the components when storing and/or transporting same. The cover is arranged to receive another tray whereby a stackable arrangement of covered trays is provided. The stackable arrangement may be strapped for providing a storable/transportable package of microelectronic components.

Abstract: Leads of an electronic component are formed in a Z-shaped configuration so as to provide a constant distance from the bottom surface of the body to the foot of the formed lead by a device having a lower floating anvil and complementary upper die unit, each of which have clamping and forming surfaces defining a Z-shaped joint therein between. The clamping surfaces are moveable relative to the forming surfaces of the anvil and the degree of movement which is permitted is controlled by preset sensing means responsive to contact with the body of the electronic component so as to produce the desired vertical distance between foot portion of the lead and the bottom surface of the component.