Patents by Inventor Ronald J. Indin

Ronald J. Indin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
    Patent number: 5347428
    Abstract: A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
    Type: Grant
    Filed: December 3, 1992
    Date of Patent: September 13, 1994
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Ronald J. Indin, Stuart N. Shanken