Patents by Inventor Ronald L. Hinds

Ronald L. Hinds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip package for micromachined semiconductors
    Patent number: 6225692
    Abstract: A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and are electrically connected to the vias. A micromachined semiconductor device abuts the bottom surface and covers the cavity such that a movable portion of the micromachined semiconductor device is unconstrained to move within the cavity. Solder is used to connect the vias to solder bumps on the semiconductor device. A seal ring is located between the micromachined semiconductor device and the ceramic assembly for hermetically sealing the micromachined semiconductor device.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: May 1, 2001
    Assignee: CTS Corporation
    Inventor: Ronald L. Hinds