Abstract: In accordance with the invention, a semiconductor die having an input/output contact surface is interconnected with a substrate. A metal plate having a surface cavity is provided for receiving the die. The plate has peripheral surface regions surrounding the cavity. The die is mounted in the cavity with its contact surface co-planar with the peripheral regions, and a sealable contact region forming closed figure around the die is provided on the peripheral surface regions of the plate. A substrate surface is provided with a corresponding contact regions for receiving the die and the plate. The plate/die structure is mounted and solder bonded on the substrate. The resulting structure has reduced thermal impedance from the die/board surface through the plate and a continuous peripheral hermetic seal around the die.

Abstract: A block processing computing system includes a decomposition unit, a control circuit, a system memory, a data block path and a block processor. The decomposition unit receives externally-supplied primitive command packets and decomposes the primitive into machine language operations on computational blocks of data. The control circuitry generates control and address signals for performing the machine level operations. The data block path includes alignment circuitry for selecting data from burst-accessed blocks of data and a macropipeline for controllably storing and transferring blocks of data to and from the block processor. The block processor has interchangeable, double-buffered local zone memories and a parallel set of pipelined vector processors for performing block operations on computational blocks of data.