Patents by Inventor Ronald M. Lahti

Ronald M. Lahti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for controlled deformation bonding
    Patent number: 5240165
    Abstract: A method of producing reliable bonds of a lead to a bump on a semiconductor chip is accomplished by controlling the amount of deformation of the lead and the bump during bonding. A differential amplifier is used to sense the deformation and stop the application of force to the lead and the bump when a desired amount of deformation of the lead and the bump is obtained.
    Type: Grant
    Filed: July 6, 1992
    Date of Patent: August 31, 1993
    Assignee: Motorola, Inc.
    Inventors: Harry J. Geyer, Ronald M. Lahti