Abstract: A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in the first dielectric layer. A cavity is then formed in the first dielectric layer and an electronic component is attached in the cavity. A second dielectric layer, strip, or panel, is then applied to the first dielectric layer, thereby encasing the electronic component in dielectric. Second via apertures are then formed through the second dielectric layer to expose selected electronic component bond pads and/or selected first electrically conductive vias and traces. The second via apertures are then filled with an electrically conductive material to form second electrically conductive vias electrically coupled to selected bond pads and selected first electrically conductive vias and traces.

Abstract: A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are uncovered by using a laser to remove overlying portions of the solder mask. If a YAG laser is used, the conductive traces are removed at the same time the solder mask ablated. However, is a CO2 laser is used, a conventional etching process removes the exposed portions of the traces after the solder mask is ablated.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A method of making a PCB having an integral heat spreader and/or central ground plane includes forming one or more first openings in a first layer of a metal at selected locations and filling the. openings with an electrically insulating material. The first sheet is laminated between second and third layers of a metal interleaved with first and second layers of a dielectric material. At least one second opening is formed through the insulating material in one of the first openings, and at least one third opening is formed in the laminate at a position displaced from the first openings. The upper and lower layers of metal are electrically connected to each other through the at least one second and third openings to define “vias” through the laminate. The vias comprise “clearance vias” from which the first metal sheet is electrically isolated, and “thermal vias” to which the first metal sheet is electrically connected.

Abstract: A novel, moisture-resistant integrated circuit chip package is disclosed. In one embodiment, the integrated circuit chip package includes a substrate having a chip side and a backside. A first conductive layer is formed on the chip side of the substrate, and has a pattern forming conductive traces. A first soldermask layer is formed on the chip side of the substrate. The first soldermask layer directly contacts the first conductive layer. The first soldermask layer has at least one opening formed therein. A first contact layer is formed over the first conductive layer in the opening of the first. soldermask layer. A second conductive layer is formed on the backside of the substrate. A second soldermask layer is formed on the back side of the substrate and has at least one opening formed therein. A second contact layer overlies the second conductive layer in the opening of the second soldermask layer.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A novel, moisture-resistant integrated circuit chip package is disclosed. In one embodiment, the integrated circuit chip package includes a rigid substrate having a chip side and a backside. A first conductive layer is formed on the chip side of the substrate, and has a pattern forming conductive traces. A first soldermask layer is formed on the chip side of the substrate. The first soldermask layer directly contacts the first conductive layer. The first soldermask layer has at least one opening formed therein. A first contact layer is formed over the first conductive layer in the opening of the first soldermask layer. A second conductive layer is formed on the backside of the substrate. A second soldermask layer is formed on the back side of the substrate and has at least one opening formed therein. A second contact layer overlies the second conductive layer in the opening of the second soldermask layer.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.