Patents by Inventor Ronald Redline

Ronald Redline has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for enhancing the solderability of a surface
    Patent number: 7267259
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: September 11, 2007
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6905587
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: June 14, 2005
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Methods of cleaning copper surfaces in the manufacture of printed circuit boards
    Publication number: 20050098538
    Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
    Type: Application
    Filed: November 10, 2003
    Publication date: May 12, 2005
    Inventors: Ying Ding, Ronald Redline, Richard Retallick, Mark Wojtaszek
  • Coating for silver plated circuits
    Patent number: 6773757
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: August 10, 2004
    Inventors: Ronald Redline, David Angelone, Steven A. Castaldi, Lenora M Toscano
  • Method for enhancing the solderability of a surface
    Publication number: 20030209446
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: June 6, 2003
    Publication date: November 13, 2003
    Applicant: MacDermid Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Publication number: 20030118742
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: January 14, 2003
    Publication date: June 26, 2003
    Applicant: MacDermid, Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6544397
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: April 8, 2003
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6444109
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: September 3, 2002
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Catalyst solutions useful in activating substrates for subsequent plating
    Publication number: 20020062760
    Abstract: An improved colloidal activator is disclosed which is useful in preparing substrates for plating. The activator comprises a source of gold, a source of tin and an organic sulfonic acid. Relatively low levels of palladium have been found to be synergistically advantageous. In addition, sulfonated surfactants have also proven to be useful. The colloidal activator may also include colloid stabilizers. A method for preparing and a process for using the activator are also disclosed.
    Type: Application
    Filed: January 22, 2002
    Publication date: May 30, 2002
    Inventors: Ronald Redline, Mark Wojtaszek
  • Method for enhancing the solderability of a surface
    Publication number: 20010016232
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: March 29, 2001
    Publication date: August 23, 2001
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6200451
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: March 13, 2001
    Assignee: MacDermid, Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for the manufacture of printed circuit boards
    Patent number: 6120639
    Abstract: A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: September 19, 2000
    Assignee: MacDermid, Incorporated
    Inventors: Ronald Redline, Lucia Justice, Lev Taytsas
  • Method for enhancing the solderability of a surface
    Patent number: RE45297
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: December 23, 2014
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: RE45842
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: January 12, 2016
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: RE45881
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant electromigration.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: February 9, 2016
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson