Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

Abstract: An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.

Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.

Abstract: A passive-matrix controller provides a control signal to each column of multiple columns of components, a driver for each column wire, and a multiplexer. Each column of components is connected to a column wire. The driver provides a drive signal in response to the control signal and the multiplexer comprises an output connected to each column wire and an input connected to each driver and connects the inputs to the outputs in response to a multiplex signal from the passive-matrix controller. The components can be inorganic micro-light-emitting diodes.

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

Abstract: A monolithic multi-FET transistor comprises an epitaxial layer disposed on a dielectric layer. The epitaxial layer comprises a crystalline semiconductor material and a multi-FET area. An isolation structure surrounds the multi-FET area and divides the multi-FET area into separate FET portions. A gate disposed on a gate dielectric extends over each FET portion. A source and a drain are each disposed on opposite sides of the gate on the epitaxial layer within each FET portion. Each gate, source, and drain comprise a separate electrical conductor and the gate, source, drain, and epitaxial layer within each FET portion form a field-effect transistor. Gate, source, and drain contacts electrically connect the gates, sources, and drains of the separate FET portions, respectively. At least the sources or drains of two neighboring FET portions are disposed in common over at least a portion of the isolation structure dividing the two neighboring FET portions.

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.

Abstract: A display comprises a transparent polymer support, an array of light emitters embedded in the support, and a redistribution layer. Each light emitter comprises electrode contacts that are substantially coplanar with a back surface of the support and emits light through a front surface of the support opposite the back surface when provided with power through the electrode contacts. The redistribution layer comprises a dielectric layer that is disposed on and in contact with the support back surface and distribution contacts that extend through the dielectric layer. Each of the distribution contacts is electrically connected to an electrode contact and is at least partially exposed.

Abstract: A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.

Abstract: A printed structure includes a target substrate and structures extending from a surface of the target substrate and a component disposed on the surface in alignment with the structures. The structures can be spatially separated independent structures. The component is non-native to the target substrate and can comprises a component substrate separate and independent from the target substrate. The component can be micro-transfer printed to the target substrate and can comprise a broken, fractured, or separated tether.

Abstract: A method of assembling components includes the steps of providing a stamp, providing a component disposed on an adhesive surface, pressing the stamp against the component to adhere the component to the stamp, pulling the stamp away from the adhesive surface, and removing the component from the adhesive surface with the stamp. The adhesive surface can deform in a direction of the stamp and can enable progressive delamination of the adhesive surface from a bottom of the component from an edge or corner of the component toward a center of the component, thereby reducing the instantaneous adhesive force between the component and at least a portion of the adhesive surface. The method can enable the transfer and assembly of many millions of small and fragile components per hour with excellent precision from a tape to a target substrate.

Abstract: An active-matrix display with passive-matrix pixel clusters includes pixel clusters each having a cluster controller and a display controller operable to provide pixel data to the cluster controllers. Each pixel cluster includes pixels disposed in an array of N rows (N>=2) and M columns (M>=1), (N+1) memory banks, and a cluster controller operable to control the pixels and memory banks. Each memory bank is operable to store pixel data for a row of pixels. The cluster controller is operable to input pixel data for a row of pixels and store the pixel data in an input memory bank of the (N+1) memory banks and output stored pixel data from one or more output memory banks of the (N+1) memory banks that are not the input memory bank to control corresponding one or more rows of pixels.

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.

Abstract: A method of making a display structure comprises providing a display substrate having a display surface, disposing components on and in contact with the display surface, uniformly blanket coating the display surface with a curable layer of uncured light-absorbing material, and curing the curable layer of uncured light-absorbing material to provide a layer of cured light-absorbing material so that the components project from the layer of cured light-absorbing material without having pattern-wise etched the layer of cured light-absorbing material after the light-absorbing material has been cured. The uniform blanket coating has a thickness greater than a thickness of the component, disposing the components comprises printing the components through the uniform blanket coating such that the components protrude from the uniform blanket coating, or the component is coated with a de-wetting material.

Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.