Patents by Inventor Ronald Schutz

Ronald Schutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7297115
    Abstract: A ultrasound platform is used to generate, process and display ultrasound images using a probe connected via a sterilizable connector. The probe is used to take ultrasound images, and can be a sterilizable finger mounted probe. The sterilizable connector includes a connector housing which has been sealed to prevent moisture from entering it, and a multi-wire cable which is electrically coupled to the probe at a first end and coupled to the connector housing at a second end. The multi-wire cable has its second end sealed with the connector housing to prevent moisture from entering the sealing between the multi-wire cable and the connector housing. A plurality of electrical contacts are formed on at least one surface of the sterilizable connector. A mating connector is used to electrically couple the sterilizable connector to a standard connector for directly connecting to the ultrasound platform.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: November 20, 2007
    Assignee: Black Toe Medical III, Inc.
    Inventors: Kenneth N. Bates, William McDonough, Ronald Schutz, Evan Dudik
  • Publication number: 20070221613
    Abstract: A structure for stopping mechanical cracks in a substrate wafer used for semiconductor device manufacturing, especially a silicon wafer, is described. The structure includes at least one depression that extends into the substrate wafer for at least 20% of the final thickness of the substrate wafer.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 27, 2007
    Inventors: Martin Gutsche, Harald Seidl, Ronald Schutz
  • Publication number: 20060001162
    Abstract: A conductive structure in an integrated circuit (12), and a method of forming the structure, is provided that includes a polysilicon layer (30), a thin layer containing titanium over the polysilicon, a tungsten nitride layer (34) over the titanium-containing layer and a tungsten layer over the tungsten nitride layer. The structure also includes a silicon nitride interfacial region (38) between the polysilicon layer and the titanium-containing layer. The structure withstands high-temperature processing without substantial formation of metal silicides in the polysilicon layer (30) and the tungsten layer (32), and provides low interface resistance between the tungsten layer and the polysilicon layer.
    Type: Application
    Filed: March 18, 2005
    Publication date: January 5, 2006
    Inventors: Ronald Schutz, Werner Robl, Rajeev Malik, Lawrence Clevenger, Oleg Gluschenkov, Cyril Cabral, Roy Iggulden, Yun-Yu Wang, Keith Wong, Irene McStay
  • Publication number: 20050215362
    Abstract: A hockey stick shaft is a hollow, thin-walled tube formed of titanium or a titanium alloy. The tube wall has a thickness which may be uniform, tapered or stepped. The titanium or titanium alloy is of an alpha, a near-alpha, an alpha-beta or a highly-aged beta type. The titanium or titanium alloy has an elastic modulus greater than 13 million pounds per square inch (psi), a yield strength above 50,000 psi and a wall thickness ranging from 0.020 to 0.045 inches. An alternate hockey stick shaft has a titanium or titanium alloy core and exterior formed of a composite material. The titanium or titanium alloy core is of an alpha, a near-alpha, an alpha-beta or a beta type and has a yield strength above roughly 40,000 psi and a wall thickness ranging from 0.010 to 0.040 inches.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Inventors: Ronald Schutz, Alan Miller
  • Publication number: 20050153643
    Abstract: A polyelectrolyte dispensing polishing pad, a process for its production and a method of polishing, e.g., chemical mechanical polishing (CMP), a substrate such as a semiconductor wafer, are provided. The pad is usable for CMP planarization of an oxide or metal layer on the wafer. The pad has a polishing layer of erodible binder material containing uniformly distributed therein both abrasive particles and a water soluble ionizable electrolyte substance such as a polyelectrolyte, such that during polishing the binder material incrementally erodes and the abrasive particles and electrolyte substance is incrementally release into direct contact with the substrate. The electrolyte substance inhibits CMP removal of silicon nitride, e.g., as a stop layer, under an upper oxide or metal layer, such that the upper layer is selectively polished and the CMP stops on the stop layer leaving the latter intact.
    Type: Application
    Filed: November 24, 2004
    Publication date: July 14, 2005
    Inventors: Alexander Simpson, Ronald Schutz
  • Publication number: 20040111029
    Abstract: A ultrasound platform is used to generate, process and display ultrasound images using a probe connected via a sterilizable connector. The probe is used to take ultrasound images, and can be a sterilizable finger mounted probe. The sterilizable connector includes a connector housing which has been sealed to prevent moisture from entering it, and a multi-wire cable which is electrically coupled to the probe at a first end and coupled to the connector housing at a second end. The multi-wire cable has its second end sealed with the connector housing to prevent moisture from entering the sealing between the multi-wire cable and the connector housing. A plurality of electrical contacts are formed on at least one surface of the sterilizable connector. A mating connector is used to electrically couple the sterilizable connector to a standard connector for directly connecting to the ultrasound platform.
    Type: Application
    Filed: November 26, 2003
    Publication date: June 10, 2004
    Inventors: Kenneth N. Bates, William McDonough, Ronald Schutz, Evan Dudik