Patents by Inventor Ronald Vought

Ronald Vought has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5218373
    Abstract: Directed millimeter wave radiation from internal elements of a microwave circuit through the housing cover, housing base, and side walls of a hermetically-sealed MMIC integrated subsystem assembly uses a waffle-wall array of conductive posts as a band rejection filter to provide walls which guide the radiated waves through a hermetically sealed window in the housing base for waveguide propagation or to a dielectric side wall or cover to radiate energy therethrough. For a waveguide launch, the launch probe is printed on a TEM mode microstrip transmission line substrate and is located over or on a dielectric window formed at the end of an air filled waveguide. A waveguide-like mode of propagation is launched perpendicular to the microstrip substrate and the energy is transmitted through the dielectric window into the air dielectric waveguide which extends through the housing base.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: June 8, 1993
    Assignee: Harris Corporation
    Inventors: Douglas Heckaman, Ronald Vought
  • Patent number: 5065123
    Abstract: A two-dimensional periodic conductive post array structure is used to suppress higher order wave propagation within a large microstrip housing assembly without attentuating the desired TEM mode of propagation. Substantially vertical conductive posts are spaced at appropriate wavelength periods in the X and Y directions on top of and through a microstrip substrate in a so called "waffle-wall" type configuration. The periodic post structure provides high microwave signal isolation by functioning as a band rejection filter both above the microstrip substrate and within the substrate to isolate between nearby active and passive circuit functions located on the microstrip substrate. The desired TEM mode microstrip transmission line is routed through the conductive post matrix to provide the signal, control and DC paths between circuit chips and other active and passive circuit functions.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: November 12, 1991
    Assignee: Harris Corporation
    Inventors: Douglas Heckaman, Ronald Vought, Edward Caraway