Patents by Inventor Ronald W. Swartz

Ronald W. Swartz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10038574
    Abstract: Described is an apparatus which comprises: a first capacitor coupled to a first input pad; a second capacitor coupled to second input pad; a first resistor coupled to the second capacitor; a third capacitor coupled in series with the first resistor; a second resistor coupled in series with the third capacitor and also coupled to the first capacitor; and a differential amplifier coupled to the first and second capacitors and to the first and second resistors.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: July 31, 2018
    Assignee: Intel Corporation
    Inventors: Syed S. Islam, Yick Yaw Ho, Ronald W. Swartz
  • Patent number: 9959222
    Abstract: A first state of an interconnect protocol is entered. A particular signal is sent according to the protocol to a device over a link. During the first state, it is detected that a response to the particular signal is received in the first state. It is determined that the device supports a configuration mode outside the protocol based on the received response. The configuration mode is entered based on the response. One or more in-band configuration messages are sent within the configuration mode.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: May 1, 2018
    Assignee: Intel Corporation
    Inventors: Huimin Chen, Keith A. Jones, John L. Baudrexl, Ronald W. Swartz, Vui Yong Liew
  • Patent number: 9910814
    Abstract: Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: March 6, 2018
    Assignee: INTEL CORPORATION
    Inventors: Bryan L. Spry, Su Wei Lim, Mikal C. Hunsaker, Rohit R. Verma, Lily P. Looi, Ronald W. Swartz, Michael W. Leddige, Vui Yong Liew
  • Publication number: 20170244581
    Abstract: Described is an apparatus which comprises: an amplifier; and a passive continuous-time linear equalizer integrated with a baseline wander (BLW) corrector, wherein the integrated equalizer and BLW corrector is coupled to the amplifier.
    Type: Application
    Filed: March 20, 2017
    Publication date: August 24, 2017
    Inventors: Syed S. ISLAM, Yick Yaw HO, Ronald W. SWARTZ
  • Patent number: 9602315
    Abstract: Described is an apparatus which comprises: an amplifier; and a passive continuous-time linear equalizer integrated with a baseline wander (BLW) corrector, wherein the integrated equalizer and BLW corrector is coupled to the amplifier.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: March 21, 2017
    Assignee: Intel Corporation
    Inventors: Syed S. Islam, Yick Yaw Ho, Ronald W. Swartz
  • Publication number: 20160173299
    Abstract: Described is an apparatus which comprises: an amplifier; and a passive continuous-time linear equalizer integrated with a baseline wander (BLW) corrector, wherein the integrated equalizer and BLW corrector is coupled to the amplifier.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Syed S. Islam, Yick Yaw Ho, Ronald W. Swartz
  • Publication number: 20160092381
    Abstract: A first state of an interconnect protocol is entered. A particular signal is sent according to the protocol to a device over a link. During the first state, it is detected that a response to the particular signal is received in the first state. It is determined that the device supports a configuration mode outside the protocol based on the received response. The configuration mode is entered based on the response. One or more in-band configuration messages are sent within the configuration mode.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 31, 2016
    Inventors: Huimin Chen, Keith A. Jones, John L. Baudrexl, Ronald W. Swartz, Vui Yong Liew
  • Publication number: 20150269109
    Abstract: Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 24, 2015
    Inventors: Bryan L. Spry, Su Wei Lim, Mikal C. Hunsaker, Rohit R. Verma, Lily P. Looi, Ronald W. Swartz, Michael W. Leddige, Vui Yong Liew
  • Patent number: 9124455
    Abstract: Techniques for embedded high speed serial interface methods are described herein. The techniques provide an apparatus for link equalization including an equalization control module to determine at least a first coefficient setting and a second coefficient setting at a remote transmitter based on an algorithm. The apparatus also includes a receiver margining module to determine a first margin value to be associated with the first coefficient setting and a second margin value to be associated with the second coefficient setting. The receiver margining module is to further determine if at least the first margin value is higher than the second margin value.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: September 1, 2015
    Assignee: Intel Corporation
    Inventors: Su Wei Lim, Ronald W. Swartz, Yueming Jiang, Hooi Kar Loo, Athourina Gevergiz, Bruce A. Tennant, Yick Yaw Ho, Poh Thiam Teoh, Jennifer Chin, Hui Shi
  • Patent number: 8253440
    Abstract: Methods and systems to calibrate an on-die resistor relative to an operating voltage of an on-die push-pull driver, and to calibrate the push-pull driver relative to the on-die resistor and relative to operating voltages of the push-pull driver. The calibrated on-die resistor may be used to calibrate receive terminations, a differential transmit termination, and a simulated far-end differential receive termination. The calibrated differential transmit termination and simulated far-end differential receive termination may be coupled in parallel to calibrate current drivers. Calibration of the current drivers may include calibrating voltage swing, and may include a first phase that simultaneously adjusts compensation to the current drivers, and a second phase that individually adjusts the compensation to the current drivers.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: August 28, 2012
    Assignee: Intel Corporation
    Inventors: John Maddux, Luke A. Johnson, Ronald W. Swartz, Donald Rush, Meetul Goyal, Rajashri Doddamani
  • Publication number: 20110050280
    Abstract: Methods and systems to calibrate an on-die resistor relative to an operating voltage of an on-die push-pull driver, and to calibrate the push-pull driver relative to the on-die resistor and relative to operating voltages of the push-pull driver. The calibrated on-die resistor may be used to calibrate receive terminations, a differential transmit termination, and a simulated far-end differential receive termination. The calibrated differential transmit termination and simulated far-end differential receive termination may be coupled in parallel to calibrate current drivers. Calibration of the current drivers may include calibrating voltage swing, and may include a first phase that simultaneously adjusts compensation to the current drivers, and a second phase that individually adjusts the compensation to the current drivers.
    Type: Application
    Filed: September 23, 2009
    Publication date: March 3, 2011
    Inventors: John Maddux, Luke A. Johnson, Ronald W. Swartz, Donald Rush, Meetul Goyal, Rajashri Doddamani
  • Publication number: 20100327957
    Abstract: A method and system to facilitate configurable input/output (I/O) termination voltage reference in a transmitter or receiver. In one embodiment of the invention, the transmitter and receiver, each has a termination circuit to select a suitable termination reference voltage based on the desired coupling type. In one embodiment of the invention, the transmitter has a termination circuit coupled with a transmission driver and the transmitter selects only one of a supply voltage, a ground voltage and a half supply voltage as a termination voltage reference of the transmission driver. The receiver has a termination circuit to select either a supply voltage or a ground voltage as a termination voltage reference of the receiver.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Inventors: Ronald W. Swartz, Vladislav Tsirkin, Ram Livne
  • Patent number: 7859298
    Abstract: A method and system to facilitate configurable input/output (I/O) termination voltage reference in a transmitter or receiver. In one embodiment of the invention, the transmitter and receiver, each has a termination circuit to select a suitable termination reference voltage based on the desired coupling type. In one embodiment of the invention, the transmitter has a termination circuit coupled with a transmission driver and the transmitter selects only one of a supply voltage, a ground voltage and a half supply voltage as a termination voltage reference of the transmission driver. The receiver has a termination circuit to select either a supply voltage or a ground voltage as a termination voltage reference of the receiver.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: December 28, 2010
    Assignee: Intel Corporation
    Inventors: Ronald W. Swartz, Vladislav Tsirkin, Ram Livne
  • Patent number: 7449919
    Abstract: A bias circuit includes multiple output legs. During a transition from a low power state to an operational state, multiple output legs are turned on to provide a bias voltage. After a suitable period, at least one of the multiple output legs is turned off.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: November 11, 2008
    Assignee: Intel Corporation
    Inventors: Tea M. Lee, Ronald W. Swartz
  • Publication number: 20080001632
    Abstract: A bias circuit includes multiple output legs. During a transition from a low power state to an operational state, multiple output legs are turned on to provide a bias voltage. After a suitable period, at least one of the multiple output legs is turned off.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Tea M. Lee, Ronald W. Swartz
  • Patent number: 7250792
    Abstract: In general, the embodiments introduce a pre-charge state between an idle state (when no data in being transmitted) and an active state (when data is being transmitted). In the pre-charge state, both differential signals are pre-charged to the common mode voltage, which is also the crossover voltage. Similarly, an additional pre-charge state is inserted between the active state and the idle state when the signals transition from active to idle. Because both signals for each bit, including the first and last bits, are being driven from the same voltage level, the quality of the first and last bits are improved to be similar in quality to the middle bits.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: July 31, 2007
    Assignee: Intel Corporation
    Inventors: Ronald W. Swartz, Yoon San Ho
  • Patent number: 7243272
    Abstract: A method for testing a data recovery circuit (DRC) includes disturbing a running variable in a closed control loop of the DRC, as the DRC is processing a received test signal. Data recovered by the DRC, while the DRC was affected by the disturbance, is evaluated.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: July 10, 2007
    Assignee: Intel Corporation
    Inventors: Tony M. Tarango, Ronald W. Swartz
  • Patent number: 7222199
    Abstract: An interface operates at an operating frequency. The interface includes transmitters and receivers that operate within the operating frequency of the interface. The interface also includes circuit elements to allow transmission of signals across the interface in which the signals have a frequency lower than the operating frequency of the interface.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 22, 2007
    Assignee: Intel Corporation
    Inventors: Paul A. Jolly, Ronald W. Swartz
  • Patent number: 7203853
    Abstract: An apparatus and method for low latency power management on a serial data link are described. In one embodiment, the method includes the detection of an electrical idle exit condition during receiver operation in an electrical idle state. Once detected, data synchronization is performed according to one or more received data synchronization training patterns. Finally, when the synchronization is performed within a determined synchronization re-establishment period, the receiver will resume operation according to a normal power state. Accordingly, the embodiment described illustrates an open loop, low latency power resumption operation for power management within 3GIO links.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: April 10, 2007
    Assignee: Intel Corporation
    Inventors: Andrew W. Martwick, Ken Drottar, David S. Dunning, Zale T. Schoenborn, Andrew M. Volk, Ronald W. Swartz, Dennis J. Miller
  • Patent number: 7154288
    Abstract: A method and an apparatus for testing transmitter and receiver have been disclosed. One embodiment of the apparatus includes a plurality of multiplexers to select one of a positive and a negative transmitter pins, and a first comparator to compare a voltage of the selected pin with a first reference voltage to determine whether there is leakage at the selected pin. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: December 26, 2006
    Assignee: Intel Corporation
    Inventors: Akira Kakizawa, Ronald W. Swartz