Abstract: A ceramic plate structure includes a first transmittance-enhancing film layer disposed between a substrate and a first binding film layer, a conductive film layer disposed between the first binding film layer and a second binding film layer, and a second transmittance-enhancing film layer disposed between the second binding film layer and a ceramic layer. The ceramic layer renders the ceramic plate structure satisfactory in terms of transmittance gain, thermal conductivity coefficient, electrical insulation, rigidity, resistance to wear and tear, and resistance to wind erosion of the ceramic plate structure. The ceramic plate structure is suitable for use with touch panels to therefore enhance the cost-effectiveness of the manufacturing process of touch panels by cutting its material costs, reducing its power consumption, and shortening its production cycle. Accordingly, the anticipated benefits and objectives of the ceramic plate structure are attained.

Abstract: A ceramic plate structure includes a first transmittance-enhancing film layer disposed between a substrate and a first binding film layer, a conductive film layer disposed between the first binding film layer and a second binding film layer, and a second transmittance-enhancing film layer disposed between the second binding film layer and a ceramic layer. The ceramic layer renders the ceramic plate structure satisfactory in terms of transmittance gain, thermal conductivity coefficient, electrical insulation, rigidity, resistance to wear and tear, and resistance to wind erosion of the ceramic plate structure. The ceramic plate structure is suitable for use with touch panels to therefore enhance the cost-effectiveness of the manufacturing process of touch panels by cutting its material costs, reducing its power consumption, and shortening its production cycle. Accordingly, the anticipated benefits and objectives of the ceramic plate structure are attained.

Abstract: A method for producing polycrystalline ceramic structure includes the steps of: a) performing a material-feeding procedure, wherein ceramic powder and associated materials are provided, ground and mixed thoroughly; b) performing a molding procedure wherein the mixed materials are pressed and molded through a cold-isostatic-pressing process and form a preform; c) performing a high sintering process and an annealing process to the preform; and d) performing a grinding-and polishing procedure to the preform so as to obtain the polycrystalline ceramic structure that is useful to make laminates for display devices of one or more specifications. The polycrystalline ceramic structure made using the method possesses desired transparence and heat transfer coefficient, and is suitable for making laminates used in display devices.

Abstract: A polycrystalline transparent ceramics laminate includes a polycrystalline ceramics laminate made of polycrystalline transparent ceramics. The polycrystalline transparent ceramics contains aluminum oxide. The polycrystalline ceramics laminate may have flat, curved, or spherical surfaces. The polycrystalline ceramics laminate has a top and a bottom opposite to the top. The polycrystalline transparent ceramics laminate has a density greater than 3.5 g/cm3, a surface roughness smaller than or equal to 1 ?m, a transparency at a thickness of 1 mm greater than or equal to 60%, and a refractive index between 1.5 and 2.5.

Abstract: An advanced copper bonding with ceramic substrate technology includes the steps of (1) forming a copper film of thickness <1 ?m on a ceramic substrate by sputtering deposition under 1.33×10?3 torr and 150° C., (2) plating a copper layer of thickness 10˜50 ?m at room temperature, and (3) bonding a copper foil to the ceramic substrate by diffusion bonding under environments of high temperature, vacuum, and negative pressure inertia gas or H2 partial pressure.