Abstract: A tramp metal removing device has a primary housing to define a product flow path for being passed by a stream of raw materials and a moving path. A secondary housing is connected to the primary housing. A plurality of drawer units are sequentially stacked on the primary housing and secondary housing. Each drawer unit has a frame, a plurality of magnetic members and a scraping assembly. The frame is coupled with the primary and secondary housings in a movable way. Each of magnetic members is secured on the frame and has a magnetic section and a non-magnetic section. The scraping assembly is coupled with the frame in a way that it is only moveable in the secondary housing for removing tramp metals of a stream of raw materials in a two-stage manner.

Abstract: A tramp metal removing device has a primary housing to define a product flow path for being passed by a stream of raw materials and a moving path. A secondary housing is connected to the primary housing. A plurality of drawer units are sequentially stacked on the primary housing and secondary housing. Each drawer unit has a frame, a plurality of magnetic members and a scraping assembly. The frame is coupled with the primary and secondary housings in a movable way. Each of magnetic members is secured on the frame and has a magnetic section and a non-magnetic section. The scraping assembly is coupled with the frame in a way that it is only moveable in the secondary housing for removing tramp metals of a stream of raw materials in a two-stage manner.

Abstract: A voice command identification method for an electronic device having a microphone matrix is provided. The method includes: obtaining a plurality of sound signals from the microphone matrix; executing a voice purify operation on the sound signals to obtain a purified sound signal and identifying a target voice signal from the purified sound signal; calculating a compound speech feature data corresponding to the target voice signal through a compound speech recognition model; comparing the compound speech feature data with a plurality of reference speech feature data in the speech feature database, so as to determine a target command mapped to the target voice signal; and executing the target command.

Abstract: A voice command identification method for an electronic device having a microphone matrix is provided. The method includes: obtaining a plurality of sound signals from the microphone matrix; executing a voice purify operation on the sound signals to obtain a purified sound signal and identifying a target voice signal from the purified sound signal; calculating a compound speech feature data corresponding to the target voice signal through a compound speech recognition model; comparing the compound speech feature data with a plurality of reference speech feature data in the speech feature database, so as to determine a target command mapped to the target voice signal; and executing the target command.

Abstract: A compact electronic device includes at least a substrate, one semiconductor chip, one passive component, and a molding compound. A plurality of conductive traces are formed on a first surface of the substrate. A plurality of terminals are peripherally formed on a second surface of the substrate and externally exposed as the input/output connections of the compact electronic device. The conductive traces on the first surface are electrically connected to the terminals on the second surface by a plurality of vias. The semiconductor chip and the passive component are mounted on the first surface of the substrate and electrically connected to the substrate through a plurality of connectors. The molding compound covers the first surface of the substrate to encapsulate both the semiconductor chip and the passive components electrically connected to the substrate.

Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A castellation is formed to create a riser surrounding the semiconductor chip. The height of the castellations can be made to a desired height so that proper clearance of the semiconductor chip and the glass window is achieved. A transparent window is placed on the top of the castellations. A liquid encapsulant is formed to protectively seal the non-ceramic image sensor semiconductor package thereby shielding the semiconductor chip and vision chip active area from the external environment.

Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between conductive parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A transparent window is placed on top of the semiconductor chip and covers the vision chip active area. A wire shielding block is formed on the multi-layer resin mask organic substrate around the semiconductor chip covering and protecting the bonding wires and the semiconductor chip not covered by the transparent window. A liquid encapsulant is formed to protectively seal the device but does not block the vision of the vision chip active area through the transparent window.

Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A castellation is formed to create a riser surrounding the semiconductor chip. The height of the castellations can be made to a desired height so that proper clearance of the semiconductor chip and the glass window is achieved. A transparent window is placed on the top of the castellations. A liquid encapsulant is formed to protectively seal the non-ceramic image sensor semiconductor package thereby shielding the semiconductor chip and vision chip active area from the external environment.

Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between conductive parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A transparent window is placed on top of the semiconductor chip and covers the vision chip active area. A wire shielding block is formed on the multi-layer resin mask organic substrate around the semiconductor chip covering and protecting the bonding wires and the semiconductor chip not covered by the transparent window. A liquid encapsulant is formed to protectively seal the device but does not block the vision of the vision chip active area through the transparent window.

Abstract: The present invention provides a ball grid array semiconductor package having a resin coated metal core substrate. The semiconductor device comprises a resin coated metal core substrate, solder balls, chip adhesive material, at least one semiconductor chip, bonding wires, and encapsulant. The metal core is made from a conductive material, for example, a metal lead frame and coated with a resin to form a resin covered metal core substrate structure. The resin coating covers both sides of the metal core except for selected areas of the metal core, such as where it is desired to attach the bonding wires or the solder balls. A liquid encapsulant is formed to cover desired areas of the resin coated substrate, bonding wires, adhesive material, and the semiconductor chip. Since the outer surface of the substrate is substantially of resin material, the adhesion between the substrate and the encapsulant is much stronger than if a standard conventional substrate was used.