Patents by Inventor Rong Shen
Rong Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8280081Abstract: An electrode connection structure of a speaker unit is provided. The speaker unit includes at least one electrode layer, which is made of a conductive material, or made of a non-conductive material with a conductive layer formed on a surface thereof. The electrode connection structure includes a conductive electrode and an adhesive material. The conductive electrode is used for providing power supply signals for the speaker unit to generate sounds. The adhesive material adheres the conductive electrode in parallel with a surface of the electrode layer. The adhesive material has adhesive characteristics, so as to electrically connect the conductive electrode and the electrode layer, in which the adhesive material is adhered to a side of the surface of the electrode layer closely adjacent to the conductive electrode with a certain area.Type: GrantFiled: December 25, 2008Date of Patent: October 2, 2012Assignee: Industrial Technology Research InstituteInventors: Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen, Rong-Shen Lee
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Patent number: 8252305Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: GrantFiled: October 24, 2011Date of Patent: August 28, 2012Assignee: A.P. PharmaInventors: Steven Y. Ng, Hui Rong Shen, Jorge Heller
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Patent number: 8252306Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: GrantFiled: October 24, 2011Date of Patent: August 28, 2012Assignee: A.P. Pharma, Inc.Inventors: Steven Y. Ng, Hui Rong Shen, Jorge Heller
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Patent number: 8252304Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: GrantFiled: September 22, 2009Date of Patent: August 28, 2012Assignee: A. P. Pharma, Inc.Inventors: Steven Y. Ng, Hui Rong Shen, Jorge Heller
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Patent number: 8249642Abstract: A wireless communication network (20) includes a power control technique that includes repeating an erasure indicator bit in a transmission from a mobile station (22) to a base station (24, 30, 36). The repeated erasure indicator bit is transmitted on the uplink to each base station. The base station then uses the majority rule of those repeated erasure indicator bits to adjust its transmit power. It results in a desired power control command corresponding to the quality of a downlink between a base station (24, 30, 36) and the mobile station (22). A disclosed example includes using the repeated error indicator bit for deciding whether a recent frame should be considered an erasure. If so, the base station increases power on the downlink forward channel. If not, the base station decreases the transmit power on the downlink forward channel. A disclosed example includes alternative power control adjustment techniques, depending on the recent history of the quality of the downlink.Type: GrantFiled: July 1, 2010Date of Patent: August 21, 2012Assignee: Alcatel LucentInventors: Dongzhe Cui, Yuan-Rong Shen
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Patent number: 8243966Abstract: An assembly structure of flat speaker including at least two speaker units and one connecting structure is provided. Each speaker unit includes a first electrode, a vibrating film, and a second electrode. The connecting structure includes two conductive layers, and a first insulating layer. A first conductive layer is connected the first electrode through a contact area, and each has a first length and a third length parallel to the contact area. A second conductive layer is connected the second electrode through a contact area, and each has a second length and a fourth, a fifth length parallel to the contact area. The third length is less than or equal to a sum of the first lengths of the speaker units. A sum of the third, the fourth, and the fifth length is less than or equal to a sum of the first and second lengths.Type: GrantFiled: August 4, 2009Date of Patent: August 14, 2012Assignee: Industrial Technology Research InstituteInventors: Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen, Rong-Shen Lee
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Publication number: 20120178212Abstract: A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses.Type: ApplicationFiled: March 20, 2012Publication date: July 12, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee
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Patent number: 8164165Abstract: A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses.Type: GrantFiled: June 20, 2006Date of Patent: April 24, 2012Assignee: Industrial Technology Research InstituteInventors: Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee
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Publication number: 20120041021Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: ApplicationFiled: October 24, 2011Publication date: February 16, 2012Applicant: A.P. PHARMA, INC.Inventors: Steven Y. Ng, Hui-Rong Shen, Jorge Heller
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Publication number: 20120041020Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: ApplicationFiled: October 24, 2011Publication date: February 16, 2012Applicant: A.P. PHARMA, INC.Inventors: Steven Y. Ng, Hui Rong Shen, Jorge Heller
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Patent number: 7981315Abstract: Polar molecules dominated electrorheological fluids mainly comprising a mixture of dispersed phase of solid particles and/or dispersing liquid medium. The dispersed phase solid particles, on the surface, or the liquid dispersing medium contain polar molecules or polar groups, the dipole moment of which is 0.5-10 deb and the size is between 0.1 nm and 0.8 nm. Dispersed phase solid particles are spherical or nearly spherical, of which the size is 10-300 nm and dielectric constant is higher than 50. The conductance rate of the liquid dispersing medium is lower than 10?8 S/m, and the dielectric constant is lower than 10. The PM-ER fluids possess the characteristics of high yield strength, high dynamic shear strength, low leakage current, the linear dependence of yield strength on electric field, and high yield strength at low electric field, etc. The yield strength improves to almost 100 times of that of ordinary ER fluids and reaches to more than 200 Kpa.Type: GrantFiled: December 15, 2008Date of Patent: July 19, 2011Assignee: Institute of Physics, Chinese Academy of SciencesInventors: Kunquan Lu, Rong Shen, Xuezhao Wang
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Publication number: 20110156249Abstract: An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.Type: ApplicationFiled: December 30, 2010Publication date: June 30, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee
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Patent number: 7948072Abstract: A wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.Type: GrantFiled: July 25, 2008Date of Patent: May 24, 2011Assignee: Industrial Technology Research InstituteInventors: Ra-Min Tain, Shu-Ming Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee, Chi-Shih Chang
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Publication number: 20100284371Abstract: A wireless communication network (20) includes a power control technique that includes repeating an erasure indicator bit in a transmission from a mobile station (22) to a base station (24, 30, 36). The repeated erasure indicator bit is transmitted on the uplink to each base station. The base station then uses the majority rule of those repeated erasure indicator bits to adjust its transmit power. It results in a desired power control command corresponding to the quality of a downlink between a base station (24, 30, 36) and the mobile station (22). A disclosed example includes using the repeated error indicator bit for deciding whether a recent frame should be considered an erasure. If so, the base station increases power on the downlink forward channel. If not, the base station decreases the transmit power on the downlink forward channel. A disclosed example includes alternative power control adjustment techniques, depending on the recent history of the quality of the downlink.Type: ApplicationFiled: July 1, 2010Publication date: November 11, 2010Inventors: Dongzhe Cui, Yuan-Rong Shen
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Publication number: 20100158284Abstract: An assembly structure of flat speaker including at least two speaker units and one connecting structure is provided. Each speaker unit includes a first electrode, a vibrating film, and a second electrode. The connecting structure includes two conductive layers, and a first insulating layer. A first conductive layer is connected the first electrode through a contact area, and each has a first length and a third length parallel to the contact area. A second conductive layer is connected the second electrode through a contact area, and each has a second length and a fourth, a fifth length parallel to the contact area. The third length is less than or equal to a sum of the first lengths of the speaker units. A sum of the third, the fourth, and the fifth length is less than or equal to a sum of the first and second lengths.Type: ApplicationFiled: August 4, 2009Publication date: June 24, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen, Rong-Shen Lee
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Publication number: 20100034402Abstract: An electrode connection structure of a speaker unit is provided. The speaker unit includes at least one electrode layer, which is made of a conductive material, or made of a non-conductive material with a conductive layer formed on a surface thereof. The electrode connection structure includes a conductive electrode and an adhesive material. The conductive electrode is used for providing power supply signals for the speaker unit to generate sounds. The adhesive material adheres the conductive electrode in parallel with a surface of the electrode layer. The adhesive material has adhesive characteristics, so as to electrically connect the conductive electrode and the electrode layer, in which the adhesive material is adhered to a side of the surface of the electrode layer closely adjacent to the conductive electrode with a certain area.Type: ApplicationFiled: December 25, 2008Publication date: February 11, 2010Applicant: Industrial Technology Research InstituteInventors: Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen, Rong-Shen Lee
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Publication number: 20100020502Abstract: a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.Type: ApplicationFiled: July 25, 2008Publication date: January 28, 2010Applicant: Industrial Technology Research InstituteInventors: Ra-Min Tain, Shu-Ming Chang, Shyi-Ching Liau, Wei-Chung Lo, Rong-Shen Lee, Chi-Shih Chang
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Publication number: 20100010104Abstract: A semi-solid delivery vehicle contains a polyorthoester and an excipient, and a semi-solid pharmaceutical composition contains an active agent and the delivery vehicle. The pharmaceutical composition may be a topical, syringable, or injectable formulation; and is suitable for local delivery of the active agent. Methods of treatment are also disclosed.Type: ApplicationFiled: September 22, 2009Publication date: January 14, 2010Inventors: Steven Y. Ng, Hui-Rong Shen, Jorge Heller
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Publication number: 20090152513Abstract: Polar molecules dominated electrorheological fluids mainly comprising a mixture of dispersed phase of solid particles and/or dispersing liquid medium. The dispersed phase solid particles, on the surface, or the liquid dispersing medium contain polar molecules or polar groups, the dipole moment of which is 0.5-10 deb and the size is between 0.1 nm and 0.8 nm. Dispersed phase solid particles are spherical or nearly spherical, of which the size is 10-300 nm and dielectric constant is higher than 50. The conductance rate of the liquid dispersing medium is lower than 10?8 S/m, and the dielectric constant is lower than 10. The PM-ER fluids possess the characteristics of high yield strength, high dynamic shear strength, low leakage current, the linear dependence of yield strength on electric field, and high yield strength at low electric field, etc. The yield strength improves to almost 100 times of that of ordinary ER fluids and reaches to more than 200 Kpa.Type: ApplicationFiled: December 15, 2008Publication date: June 18, 2009Applicant: INSTITUTE OF PHYSICS, CHINESE ACADEMY OF SCIENCESInventors: Kunquan Lu, Rong Shen, Xuezhao Wang
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Publication number: 20090136394Abstract: The invention relates to modified electrodes for ER fluids prepared by adding a rough, wear-resisting, and low conductive modified layer on the surface of metallic electrodes. The material for the modified layer can be at least one from diamond, alumina, titanium dioxide, carborundum, titanium nitride, nylon, polytetrafluoroethylene, adhesive, and adhesive film. Through the addition of the modified layer, the adhesion of the ER fluid to electrodes is increased so that the shear stress measured near the plates is close to the intrinsic value, which makes the ER fluid applicable, while reducing the leakage current and increasing the breakdown voltage of the ER fluid equipment.Type: ApplicationFiled: June 15, 2007Publication date: May 28, 2009Applicant: INSTITUTE OF PHYSICS, CHINESE ACADEMY OF SCIENCESInventors: Kunquan Lu, Rong Shen, Xuezhao Wang