Patents by Inventor RongQing Roy Yu

RongQing Roy Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for electroplating microscopic features uniformly across a large substrate
    Patent number: 6669833
    Abstract: A process and apparatus are provided for electroplating a film onto a substrate having a top side including a plating surface includes the following steps. Provide a plating tank with an electroplating bath. Provide an anode in the bath. Place a substrate having a plating surface to be electroplated into the electroplating bath connecting surfaces to be plated to a first cathode. Support a second cathode including a portion thereof with openings therethrough extending across the plating surface of the substrate and positioned between the substrate and the anode. Connect power to provide a negative voltage to the first cathode and provide a negative voltage to the second cathode, and provide a positive voltage to the anode.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: December 30, 2003
    Assignee: International Business Machines Corporation
    Inventors: Suryanarayana Kaja, Chandrika Prasad, RongQing Roy Yu
  • PROCESS AND APPARATUS FOR ELECTROPLATING MICROSCOPIC FEATURES UNIFORMLY ACROSS A LARGE SUBSTRATE
    Publication number: 20030168340
    Abstract: A process and apparatus are provided for electroplating a film onto a substrate having a top side including a plating surface includes the following steps. Provide a plating tank with an electroplating bath. Provide an anode in the bath. Place a substrate having a plating surface to be electroplated into the electroplating bath connecting surfaces to be plated to a first cathode. Support a second cathode including a portion thereof with openings therethrough extending across the plating surface of the substrate and positioned between the substrate and the anode. Connect power to provide a negative voltage to the first cathode and provide a negative voltage to the second cathode, and provide a positive voltage to the anode.
    Type: Application
    Filed: April 2, 2003
    Publication date: September 11, 2003
    Inventors: Suryanarayana Kaja, Chandrika Prasad, RongQing Roy Yu